linux-kernel - Re: [PATCH 1/6] dt-bindings: arm: ti: Add bindings for J721E SoC

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Date:   Fri, 14 Jun 2019 10:45:36 -0600
From:   Rob Herring <robh@...nel.org>
To:     Nishanth Menon <nm@...com>
Cc:     Arnd Bergmann <arnd@...db.de>, Olof Johansson <olof@...om.net>,
        Santosh Shilimkar <ssantosh@...nel.org>,
        Will Deacon <will.deacon@....com>,
        Catalin Marinas <catalin.marinas@....com>,
        Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
        Mark Rutland <mark.rutland@....com>,
        Rob Herring <robh+dt@...nel.org>, linux-serial@...r.kernel.org,
        linux-kernel@...r.kernel.org, devicetree@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org,
        Tony Lindgren <tony@...mide.com>,
        Russell King <linux@...linux.org.uk>,
        Tero Kristo <t-kristo@...com>, Nishanth Menon <nm@...com>
Subject: Re: [PATCH 1/6] dt-bindings: arm: ti: Add bindings for J721E SoC

On Wed, 22 May 2019 11:19:16 -0500, Nishanth Menon wrote:
> The J721E SoC belongs to the K3 Multicore SoC architecture platform,
> providing advanced system integration to enable lower system costs
> of automotive applications such as infotainment, cluster, premium
> Audio, Gateway, industrial and a range of broad market applications.
> This SoC is designed around reducing the system cost by eliminating
> the need of an external system MCU and is targeted towards ASIL-B/C
> certification/requirements in addition to allowing complex software
> and system use-cases.
> 
> Some highlights of this SoC are:
> * Dual Cortex-A72s in a single cluster, three clusters of lockstep
>   capable dual Cortex-R5F MCUs, Deep-learning Matrix Multiply Accelerator(MMA),
>   C7x floating point Vector DSP, Two C66x floating point DSPs.
> * 3D GPU PowerVR Rogue 8XE GE8430
> * Vision Processing Accelerator (VPAC) with image signal processor and Depth
>   and Motion Processing Accelerator (DMPAC)
> * Two Gigabit Industrial Communication Subsystems (ICSSG), each with dual
>   PRUs and dual RTUs
> * Two CSI2.0 4L RX plus one CSI2.0 4L TX, one eDP/DP, One DSI Tx, and
>   up to two DPI interfaces.
> * Integrated Ethernet switch supporting up to a total of 8 external ports in
>   addition to legacy Ethernet switch of up to 2 ports.
> * System MMU (SMMU) Version 3.0 and advanced virtualisation
>   capabilities.
> * Upto 4 PCIe-GEN3 controllers, 2 USB3.0 Dual-role device subsystems,
>   16 MCANs, 12 McASP, eMMC and SD, UFS, OSPI/HyperBus memory controller, QSPI,
>   I3C and I2C, eCAP/eQEP, eHRPWM, MLB among other peripherals.
> * Two hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
>   management.
> * Configurable L3 Cache and IO-coherent architecture with high data throughput
>   capable distributed DMA architecture under NAVSS
> * Centralized System Controller for Security, Power, and Resource
>   Management (DMSC)
> 
> See J721E Technical Reference Manual (SPRUIL1, May 2019)
> for further details: http://www.ti.com/lit/pdf/spruil1
> 
> Signed-off-by: Nishanth Menon <nm@...com>
> ---
>  Documentation/devicetree/bindings/arm/ti/k3.txt | 3 +++
>  1 file changed, 3 insertions(+)
> 

Reviewed-by: Rob Herring <robh@...nel.org>