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Date:   Sat, 20 Jul 2019 12:13:18 +0200
From:   Maxime Ripard <maxime.ripard@...tlin.com>
To:     Icenowy Zheng <icenowy@...c.io>
Cc:     Rob Herring <robh+dt@...nel.org>, Chen-Yu Tsai <wens@...e.org>,
        Linus Walleij <linus.walleij@...aro.org>,
        devicetree@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
        linux-kernel@...r.kernel.org, linux-clk@...r.kernel.org,
        linux-gpio@...r.kernel.org, linux-sunxi@...glegroups.com
Subject: Re: [PATCH v4 7/8] dt-bindings: arm: sunxi: add binding for Lichee
 Zero Plus core board

On Sat, Jul 13, 2019 at 11:46:33AM +0800, Icenowy Zheng wrote:
> The Lichee Zero Plus is a core board made by Sipeed, with a microUSB
> connector on it, TF slot or WSON8 SD chip, optional eMMC or SPI Flash.
> It has a gold finger connector for expansion, and UART is available from
> reserved pins w/ 2.54mm pitch. The board can use either SoChip S3 or
> Allwinner V3L SoCs.
>
> Add the device tree binding of the basic version of the core board --
> w/o eMMC or SPI Flash, w/ TF slot or WSON8 SD, and use S3 SoC.
>
> Signed-off-by: Icenowy Zheng <icenowy@...c.io>
> ---
> No changes since v3.
>
> Patch introduced in v2.
>
>  Documentation/devicetree/bindings/arm/sunxi.yaml | 5 +++++
>  1 file changed, 5 insertions(+)
>
> diff --git a/Documentation/devicetree/bindings/arm/sunxi.yaml b/Documentation/devicetree/bindings/arm/sunxi.yaml
> index 000a00d12d6a..48c126a7a848 100644
> --- a/Documentation/devicetree/bindings/arm/sunxi.yaml
> +++ b/Documentation/devicetree/bindings/arm/sunxi.yaml
> @@ -353,6 +353,11 @@ properties:
>            - const: licheepi,licheepi-zero
>            - const: allwinner,sun8i-v3s
>
> +      - description: Lichee Zero Plus (with S3, without eMMC/SPI Flash)
> +        items:
> +          - const: sipeed,lichee-zero-plus
> +          - const: allwinner,sun8i-s3

If the S3 is just a rebranded V3, then we should have the v3 compatile
in that list too.

Maxime

--
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com

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