linux-kernel - Re: [PATCH v1 1/3] dt-bindings: rockchip-thermal: Support the RK3308 SoC compatible

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Message-ID: <20191107002518.GA20339@bogus>
Date:   Wed, 6 Nov 2019 18:25:18 -0600
From:   Rob Herring <robh@...nel.org>
To:     Elaine Zhang <zhangqing@...k-chips.com>
Cc:     heiko@...ech.de, mark.rutland@....com, devicetree@...r.kernel.org,
        amit.kucheria@...durent.com,
        Elaine Zhang <zhangqing@...k-chips.com>,
        huangtao@...k-chips.com, linux-pm@...r.kernel.org,
        xxx@...k-chips.com, daniel.lezcano@...aro.org,
        linux-kernel@...r.kernel.org, xf@...k-chips.com,
        edubezval@...il.com, linux-rockchip@...ts.infradead.org,
        robh+dt@...nel.org, andy.yan@...k-chips.com, rui.zhang@...el.com,
        linux-arm-kernel@...ts.infradead.org
Subject: Re: [PATCH v1 1/3] dt-bindings: rockchip-thermal: Support the RK3308
 SoC  compatible

On Tue,  5 Nov 2019 11:17:24 +0800, Elaine Zhang wrote:
> Add a new compatible for thermal founding on RK3308 SoCs.
> 
> Signed-off-by: Elaine Zhang <zhangqing@...k-chips.com>
> ---
>  Documentation/devicetree/bindings/thermal/rockchip-thermal.txt | 1 +
>  1 file changed, 1 insertion(+)
> 

Acked-by: Rob Herring <robh@...nel.org>