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Date: Wed, 4 Dec 2019 09:57:20 +0530
From: Amit Kucheria <amit.kucheria@...aro.org>
To: Daniel Lezcano <daniel.lezcano@...aro.org>
Cc: Viresh Kumar <viresh.kumar@...aro.org>,
Zhang Rui <rui.zhang@...el.com>,
"Rafael J. Wysocki" <rjw@...ysocki.net>,
Eduardo Valentin <edubezval@...il.com>,
Linux PM list <linux-pm@...r.kernel.org>,
Linux Kernel Mailing List <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH V3 4/4] thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
On Tue, Dec 3, 2019 at 3:07 PM Daniel Lezcano <daniel.lezcano@...aro.org> wrote:
>
> As we introduced the idle injection cooling device called
> cpuidle_cooling, let's be consistent and rename the cpu_cooling to
> cpufreq_cooling as this one mitigates with OPPs changes.
>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@...aro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@...aro.org>
> ---
> V3:
> - Fix missing name conversion (Viresh Kumar)
> ---
> Documentation/driver-api/thermal/exynos_thermal.rst | 2 +-
> MAINTAINERS | 2 +-
> drivers/thermal/Makefile | 2 +-
> drivers/thermal/clock_cooling.c | 2 +-
> drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} | 6 +++---
> include/linux/clock_cooling.h | 2 +-
> 6 files changed, 8 insertions(+), 8 deletions(-)
> rename drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} (99%)
>
> diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst
> index 5bd556566c70..d4e4a5b75805 100644
> --- a/Documentation/driver-api/thermal/exynos_thermal.rst
> +++ b/Documentation/driver-api/thermal/exynos_thermal.rst
> @@ -67,7 +67,7 @@ TMU driver description:
> The exynos thermal driver is structured as::
>
> Kernel Core thermal framework
> - (thermal_core.c, step_wise.c, cpu_cooling.c)
> + (thermal_core.c, step_wise.c, cpufreq_cooling.c)
> ^
> |
> |
> diff --git a/MAINTAINERS b/MAINTAINERS
> index d2e92a0360f2..26e4be914765 100644
> --- a/MAINTAINERS
> +++ b/MAINTAINERS
> @@ -16194,7 +16194,7 @@ L: linux-pm@...r.kernel.org
> S: Supported
> F: Documentation/driver-api/thermal/cpu-cooling-api.rst
> F: Documentation/driver-api/thermal/cpu-idle-cooling.rst
> -F: drivers/thermal/cpu_cooling.c
> +F: drivers/thermal/cpufreq_cooling.c
> F: drivers/thermal/cpuidle_cooling.c
> F: include/linux/cpu_cooling.h
>
> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
> index 9c8aa2d4bd28..5c98472ffd8b 100644
> --- a/drivers/thermal/Makefile
> +++ b/drivers/thermal/Makefile
> @@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
> thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o
>
> # cpufreq cooling
> -thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o
> +thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o
> thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o
>
> # clock cooling
> diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c
> index 3ad3256c48fd..7cb3ae4b44ee 100644
> --- a/drivers/thermal/clock_cooling.c
> +++ b/drivers/thermal/clock_cooling.c
> @@ -7,7 +7,7 @@
> * Copyright (C) 2013 Texas Instruments Inc.
> * Contact: Eduardo Valentin <eduardo.valentin@...com>
> *
> - * Highly based on cpu_cooling.c.
> + * Highly based on cpufreq_cooling.c.
> * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
> * Copyright (C) 2012 Amit Daniel <amit.kachhap@...aro.org>
> */
> diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c
> similarity index 99%
> rename from drivers/thermal/cpu_cooling.c
> rename to drivers/thermal/cpufreq_cooling.c
> index 6b9865c786ba..3a3f9cf94b6d 100644
> --- a/drivers/thermal/cpu_cooling.c
> +++ b/drivers/thermal/cpufreq_cooling.c
> @@ -1,6 +1,6 @@
> // SPDX-License-Identifier: GPL-2.0
> /*
> - * linux/drivers/thermal/cpu_cooling.c
> + * linux/drivers/thermal/cpufreq_cooling.c
> *
> * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
> *
> @@ -694,7 +694,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
> u32 capacitance = 0;
>
> if (!np) {
> - pr_err("cpu_cooling: OF node not available for cpu%d\n",
> + pr_err("cpufreq_cooling: OF node not available for cpu%d\n",
> policy->cpu);
> return NULL;
> }
> @@ -705,7 +705,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
>
> cdev = __cpufreq_cooling_register(np, policy, capacitance);
> if (IS_ERR(cdev)) {
> - pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n",
> + pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n",
> policy->cpu, PTR_ERR(cdev));
> cdev = NULL;
> }
> diff --git a/include/linux/clock_cooling.h b/include/linux/clock_cooling.h
> index b5cebf766e02..4b0a69863656 100644
> --- a/include/linux/clock_cooling.h
> +++ b/include/linux/clock_cooling.h
> @@ -7,7 +7,7 @@
> * Copyright (C) 2013 Texas Instruments Inc.
> * Contact: Eduardo Valentin <eduardo.valentin@...com>
> *
> - * Highly based on cpu_cooling.c.
> + * Highly based on cpufreq_cooling.c.
> * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
> * Copyright (C) 2012 Amit Daniel <amit.kachhap@...aro.org>
> */
> --
> 2.17.1
>
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