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Message-ID: <69dd3a7a-c5fe-3ae7-8a4d-c3939870eed8@linaro.org>
Date: Tue, 10 Dec 2019 15:36:07 +0100
From: Daniel Lezcano <daniel.lezcano@...aro.org>
To: Wei Wang <wvw@...gle.com>
Cc: wei.vince.wang@...il.com, Zhang Rui <rui.zhang@...el.com>,
Eduardo Valentin <edubezval@...il.com>,
Amit Kucheria <amit.kucheria@...durent.com>,
linux-pm@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH v3 0/3] thermal: introduce by-name softlink
On 05/12/2019 08:19, Wei Wang wrote:
> The paths thermal_zone%d and cooling_device%d are not intuitive and the
> numbers are subject to change due to device tree change. This usually
> leads to tree traversal in userspace code.
> The patch creates `tz-by-name' and `cdev-by-name' for thermal zone and
> cooling_device respectively.
Instead of adding another ABI, I suggest we put the current one
deprecated with a warning in the dmesg, update the documentation and
change the name the next version.
> Changes since v1 [1]:
> * Split cooling device registration into a seperate patch
> Changes since v2 [2]:
> * Split improve error message in thermal zone registration
>
> [1]: v1: https://lore.kernel.org/patchwork/patch/1139450/
> [2]: v2: https://lkml.org/lkml/2019/12/4/1291
>
> Wei Wang (3):
> thermal: prevent cooling device with no type to be registered
> thermal: improve error message in thermal zone registration
> thermal: create softlink by name for thermal_zone and cooling_device
>
> drivers/thermal/thermal_core.c | 55 +++++++++++++++++++++++++++-------
> 1 file changed, 44 insertions(+), 11 deletions(-)
>
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