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Date:   Fri, 13 Dec 2019 16:00:11 -0800
From:   Florian Fainelli <f.fainelli@...il.com>
To:     Rob Herring <robh@...nel.org>, Ray Jui <ray.jui@...adcom.com>,
        Stefan Wahren <wahrenst@....net>
Cc:     Mark Rutland <mark.rutland@....com>, devicetree@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
        bcm-kernel-feedback-list@...adcom.com,
        Rayagonda Kokatanur <rayagonda.kokatanur@...adcom.com>
Subject: Re: [PATCH 1/2] dt-bindings: soc: Add binding doc for iProc IDM
 device



On 12/13/2019 3:50 PM, Rob Herring wrote:
> On Fri, Dec 06, 2019 at 05:09:34PM -0800, Ray Jui wrote:
>>
>>
>> On 12/5/19 4:09 PM, Florian Fainelli wrote:
>>> On 12/2/19 3:31 PM, Ray Jui wrote:
>>>> Add binding document for iProc based IDM devices.
>>>>
>>>> Signed-off-by: Ray Jui <ray.jui@...adcom.com>
>>>
>>> Looks good to me, it's 2019, nearly 2020, maybe make this a YAML
>>> compatible binding since it is a new one?
>>>
>>
>> Sorry I am not aware of this YAML requirement until now.
>>
>> Is this a new requirement that new DT binding document should be made with
>> YAML format?
> 
> The format has been in place in the kernel for a year now and we've 
> moved slowly towards it being required. If you're paying that little 
> attention to upstream, then yes it's definitely required so someone else 
> doesn't get stuck converting your binding later.
> 
> BTW, I think all but RPi chips still need their SoC/board bindings 
> converted. One of the few not yet converted...

Is there something more to do than what Stefan did here:

https://git.kernel.org/pub/scm/linux/kernel/git/torvalds/linux.git/commit/?id=ab06837dd269b600396b298e9f4678d02b11b71d

we could convert other Broadcom SoCs, and there, just found another
weekend project!
-- 
Florian

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