[<prev] [next>] [thread-next>] [day] [month] [year] [list]
Message-Id: <20200116141800.9828-1-linux@roeck-us.net>
Date: Thu, 16 Jan 2020 06:17:56 -0800
From: Guenter Roeck <linux@...ck-us.net>
To: linux-hwmon@...r.kernel.org
Cc: Clemens Ladisch <clemens@...isch.de>,
Jean Delvare <jdelvare@...e.com>, linux-kernel@...r.kernel.org,
Guenter Roeck <linux@...ck-us.net>
Subject: [RFT PATCH 0/4] hwmon: k10temp driver improvements
This patch series implements various improvements for the k10temp driver.
Patch 1/4 introduces the use of bit operations.
Patch 2/4 converts the driver to use the devm_hwmon_device_register_with_info
API. This not only simplifies the code and reduces its size, it also
makes the code easier to maintain and enhance.
Patch 3/4 adds support for reporting Core Complex Die (CCD) temperatures
on Ryzen 3 (Zen2) CPUs.
Patch 4/4 adds support for reporting core and SoC current and voltage
information on Ryzen CPUs.
With all patches in place, output on Ryzen 3900 CPUs looks as follows
(with the system under load).
k10temp-pci-00c3
Adapter: PCI adapter
Vcore: +1.36 V
Vsoc: +1.18 V
Tdie: +86.8°C (high = +70.0°C)
Tctl: +86.8°C
Tccd1: +80.0°C
Tccd2: +81.8°C
Icore: +44.14 A
Isoc: +13.83 A
The patch series has only been tested with Ryzen 3900 CPUs. Further test
coverage will be necessary before the changes can be applied to the Linux
kernel.
Powered by blists - more mailing lists