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Message-ID: <20200218213137.GA8767@bogus>
Date: Tue, 18 Feb 2020 15:31:37 -0600
From: Rob Herring <robh@...nel.org>
To: Sibi Sankar <sibis@...eaurora.org>
Cc: robh+dt@...nel.org, georgi.djakov@...aro.org, evgreen@...omium.org,
bjorn.andersson@...aro.org, agross@...nel.org,
linux-kernel@...r.kernel.org, devicetree@...r.kernel.org,
linux-arm-msm@...r.kernel.org, mark.rutland@....com,
daidavid1@...eaurora.org, saravanak@...gle.com, mka@...omium.org,
linux-pm@...r.kernel.org, Odelu Kukatla <okukatla@...eaurora.org>,
Sibi Sankar <sibis@...eaurora.org>
Subject: Re: [PATCH v3 3/6] dt-bindings: interconnect: Update Qualcomm SDM845
DT bindings
On Mon, 10 Feb 2020 00:04:08 +0530, Sibi Sankar wrote:
> From: David Dai <daidavid1@...eaurora.org>
>
> Redefine the Network-on-Chip devices to more accurately describe
> the interconnect topology on Qualcomm's SDM845 platform. Each
> interconnect device can communicate with different instances of the
> RPMh hardware which are described as RSCs(Resource State Coordinators).
>
> Signed-off-by: David Dai <daidavid1@...eaurora.org>
> Signed-off-by: Odelu Kukatla <okukatla@...eaurora.org>
> Signed-off-by: Sibi Sankar <sibis@...eaurora.org>
> ---
> .../bindings/interconnect/qcom,sdm845.yaml | 49 +++++++++++++++----
> 1 file changed, 40 insertions(+), 9 deletions(-)
>
Reviewed-by: Rob Herring <robh@...nel.org>
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