linux-kernel - Re: [RFC PATCH v5 0/3] Convert thermal bindings to yaml

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Message-ID: <CAHLCerPQ1MhxHPYx9sODTf25MFzEYO7W8rREdarTUCGHJzZ2LQ@mail.gmail.com>
Date:   Mon, 24 Feb 2020 12:52:07 +0530
From:   Amit Kucheria <amit.kucheria@...durent.com>
To:     LKML <linux-kernel@...r.kernel.org>,
        linux-arm-msm <linux-arm-msm@...r.kernel.org>,
        Stephen Boyd <swboyd@...omium.org>,
        Matthias Kaehlcke <mka@...omium.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Amit Kucheria <amit.kucheria@...durent.com>,
        Zhang Rui <rui.zhang@...el.com>
Cc:     "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" 
        <devicetree@...r.kernel.org>,
        Linux PM list <linux-pm@...r.kernel.org>
Subject: Re: [RFC PATCH v5 0/3] Convert thermal bindings to yaml

Sigh, typo on my part with the version of the series. Will resend with
corrections.

On Mon, Feb 24, 2020 at 12:50 PM Amit Kucheria <amit.kucheria@...aro.org> wrote:
>
> Hi all,
>
> Here is a series splitting up the thermal bindings into 3 separate bindings
> in YAML, one each of the sensor, cooling-device and the thermal zones.
> Since I was learning about YAML parsers while creating these bindings,
> there are bound to be some issues.
>
> I have to add that the bindings as they exist today, don't really follow
> the "describe the hardware" model of devicetree. e.g. the entire
> thermal-zone binding is a software abstraction to tie arbitrary,
> board-specific trip points to cooling strategies. This doesn't fit well
> into the model where the same SoC in two different form-factor devices e.g.
> mobile and laptop, will have fairly different thermal profiles and might
> benefit from different trip points and mitigation heuristics. I've started
> some experiments with moving the thermal zone data to a board-specific
> platform data that is used to initialise a "thermal zone driver".
>
> In any case, if we ever move down that path, it'll probably end up being v2
> of the binding, so this series is still relevant.
>
> Please help review.
>
> Regards,
> Amit
>
>
> Amit Kucheria (3):
>   dt-bindings: thermal: Add yaml bindings for thermal sensors
>   dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
>   dt-bindings: thermal: Add yaml bindings for thermal zones
>
>  .../thermal/thermal-cooling-devices.yaml      | 114 +++++++
>  .../bindings/thermal/thermal-sensor.yaml      |  70 ++++
>  .../bindings/thermal/thermal-zones.yaml       | 302 ++++++++++++++++++
>  3 files changed, 486 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml
>
> --
> 2.20.1
>