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Message-Id: <11f9128efef92b427d93a563d5b53b62c4c01888.1582528977.git.amit.kucheria@linaro.org>
Date: Mon, 24 Feb 2020 12:55:35 +0530
From: Amit Kucheria <amit.kucheria@...aro.org>
To: linux-kernel@...r.kernel.org, linux-arm-msm@...r.kernel.org,
swboyd@...omium.org, mka@...omium.org, daniel.lezcano@...aro.org,
Amit Kucheria <amit.kucheria@...durent.com>,
Zhang Rui <rui.zhang@...el.com>
Cc: linux-pm@...r.kernel.org, devicetree@...r.kernel.org
Subject: [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors
As part of moving the thermal bindings to YAML, split it up into 3
bindings: thermal sensors, cooling devices and thermal zones.
The property #thermal-sensor-cells is required in each device that acts
as a thermal sensor. It is used to uniquely identify the instance of the
thermal sensor inside the system.
Signed-off-by: Amit Kucheria <amit.kucheria@...aro.org>
---
.../bindings/thermal/thermal-sensor.yaml | 70 +++++++++++++++++++
1 file changed, 70 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
new file mode 100644
index 000000000000..ac32f54f2f98
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
@@ -0,0 +1,70 @@
+# SPDX-License-Identifier: (GPL-2.0 OR MIT)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Thermal sensor binding
+
+maintainers:
+ - Amit Kucheria <amitk@...nel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of thermal zones required to take appropriate
+ action to mitigate thermal overloads.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or artively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the thermal-sensor.
+
+ Thermal sensor devices provide temperature sensing capabilities on thermal
+ zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
+ devices may control one or more internal sensors.
+
+properties:
+ "#thermal-sensor-cells":
+ description:
+ Used to uniquely identify a thermal sensor instance within an IC. Will be
+ 0 on sensor nodes with only a single sensor and at least 1 on nodes
+ containing several internal sensors.
+ enum: [0, 1]
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+
+ // Example 1: SDM845 TSENS
+ soc: soc@0 {
+ #address-cells = <2>;
+ #size-cells = <2>;
+
+ /* ... */
+
+ tsens0: thermal-sensor@...3000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c263000 0 0x1ff>, /* TM */
+ <0 0x0c222000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <13>;
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow";
+ #thermal-sensor-cells = <1>;
+ };
+
+ tsens1: thermal-sensor@...5000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c265000 0 0x1ff>, /* TM */
+ <0 0x0c223000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <8>;
+ interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow";
+ #thermal-sensor-cells = <1>;
+ };
+ };
+...
--
2.20.1
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