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Message-ID: <6d5842b0-25a5-785d-d8cc-34b9eb9fca50@arm.com>
Date: Fri, 13 Mar 2020 15:28:00 +0000
From: Lukasz Luba <lukasz.luba@....com>
To: Daniel Lezcano <daniel.lezcano@...aro.org>,
linux-kernel@...r.kernel.org, rui.zhang@...el.com,
linux-pm@...r.kernel.org, linux-doc@...r.kernel.org
Cc: amit.kucheria@...durent.com, corbet@....net,
dietmar.eggemann@....com
Subject: Re: [PATCH 0/3] Thermal extensions for flexibility in cooling device
bindings
Hi Daniel,
On 3/13/20 1:33 PM, Daniel Lezcano wrote:
>
> Hi Lukasz,
>
> On 16/12/2019 15:06, lukasz.luba@....com wrote:
>> From: Lukasz Luba <lukasz.luba@....com>
>>
>> Hi all,
>>
>> This patch set adds extensions to existing thermal zones and cooling devices
>> binding. Currently they are pinned using static definitions e.g. DT cooling
>> maps. These changes enable userspace like trusted middleware to change the
>> layout of cooling maps unbinding and binding the cooling devices.
>> It might be helpful for drivers loaded as a modules. They can be added to
>> existing thermal zones to take part of the power split.
>> It is based on the current work in thermal branch thermal/linux-next
>> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next
>
> I've been keeping this series out of the previous merge because it did
> not raise any comments and we are touching the sysfs.
>
> For this release, I still don't know what to do with it.
Thank you for bringing this back.
>
> Anyone a comment on this series? Rui ?
>
Regards,
Lukasz
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