linux-kernel - Re: [PATCH v3 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices

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Message-ID: <a89df770-eeb9-e4f2-2a46-ee4389720597@arm.com>
Date:   Wed, 25 Mar 2020 10:21:14 +0000
From:   Lukasz Luba <lukasz.luba@....com>
To:     Amit Kucheria <amit.kucheria@...aro.org>,
        linux-kernel@...r.kernel.org, linux-arm-msm@...r.kernel.org,
        swboyd@...omium.org, mka@...omium.org, daniel.lezcano@...aro.org,
        Amit Kucheria <amit.kucheria@...durent.com>,
        Zhang Rui <rui.zhang@...el.com>
Cc:     linux-pm@...r.kernel.org, devicetree@...r.kernel.org
Subject: Re: [PATCH v3 2/3] dt-bindings: thermal: Add yaml bindings for
 thermal cooling-devices

Hi Amit,

On 3/25/20 6:34 AM, Amit Kucheria wrote:
> As part of moving the thermal bindings to YAML, split it up into 3
> bindings: thermal sensors, cooling devices and thermal zones.
> 
> The property #cooling-cells is required in each device that acts as a
> cooling device - whether active or passive. So any device that can
> throttle its performance to passively reduce heat dissipation (e.g.
> cpus, gpus) and any device that can actively dissipate heat at different
> levels (e.g. fans) will contain this property.
> 
> Signed-off-by: Amit Kucheria <amit.kucheria@...aro.org>
> ---
>   .../thermal/thermal-cooling-devices.yaml      | 116 ++++++++++++++++++
>   1 file changed, 116 insertions(+)
>   create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> 
> diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> new file mode 100644
> index 000000000000..b5599f7859f8
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
> @@ -0,0 +1,116 @@
> +# SPDX-License-Identifier: (GPL-2.0)
> +# Copyright 2020 Linaro Ltd.
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Thermal cooling device binding
> +
> +maintainers:
> +  - Amit Kucheria <amitk@...nel.org>
> +
> +description: |
> +  Thermal management is achieved in devicetree by describing the sensor hardware
> +  and the software abstraction of cooling devices and thermal zones required to
> +  take appropriate action to mitigate thermal overload.
> +
> +  The following node types are used to completely describe a thermal management
> +  system in devicetree:
> +   - thermal-sensor: device that measures temperature, has SoC-specific bindings
> +   - cooling-device: device used to dissipate heat either passively or artively
> +   - thermal-zones: a container of the following node types used to describe all
> +     thermal data for the platform
> +
> +  This binding describes the cooling devices.
> +
> +  There are essentially two ways to provide control on power dissipation:
> +    - Passive cooling: by means of regulating device performance. A typical
> +      passive cooling mechanism is a CPU that has dynamic voltage and frequency
> +      scaling (DVFS), and uses lower frequencies as cooling states.
> +    - Active cooling: by means of activating devices in order to remove the
> +      dissipated heat, e.g. regulating fan speeds.
> +
> +  Any cooling device has a range of cooling states (i.e. different levels of
> +  heat dissipation). They also have a way to determine the state of cooling in
> +  which the device is. For example, a fan's cooling states correspond to the
> +  different fan speeds possible. Cooling states are referred to by single
> +  unsigned integers, where larger numbers mean greater heat dissipation. The
> +  precise set of cooling states associated with a device should be defined in
> +  a particular device's binding.

[snip]

> +
> +    thermal-zones {
> +            cpu0-thermal {
> +                    polling-delay-passive = <250>;
> +                    polling-delay = <1000>;
> +
> +                    thermal-sensors = <&tsens0 1>;
> +
> +                    trips {
> +                            cpu0_alert0: trip-point0 {
> +                                    temperature = <90000>;
> +                                    hysteresis = <2000>;
> +                                    type = "passive";
> +                            };
> +                    };
> +
> +                    cooling-maps {
> +                            map0 {
> +                                    trip = <&cpu0_alert0>;
> +                                    cooling-device = <&CPU0 THERMAL_NO_LIMIT
> +                                                            THERMAL_NO_LIMIT>;

Maybe add something like this, to better reflect the description:

			trip = <&cpu0_alert0>;
			/* Corresponds to 1000MHz in OPP table */
			cooling-device = <&CPU0 5 5>;

This is less confusing than THERMAL_NO_LIMIT.
			
Regards,
Lukasz