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Date:   Fri, 03 Apr 2020 18:23:31 +0200
From:   Michał Mirosław <mirq-linux@...e.qmqm.pl>
To:     Sebastian Reichel <sebastian.reichel@...labora.com>,
        Guenter Roeck <linux@...ck-us.net>,
        Andrey Smirnov <andrew.smirnov@...il.com>
Cc:     linux-pm@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: [PATCH v2 3/8] power: supply: core: fix HWMON temperature labels

tempX_label files are swapped compared to what
power_supply_hwmon_temp_to_property() uses. Make them match.

Cc: stable@...r.kernel.org
Fixes: e67d4dfc9ff1 ("power: supply: Add HWMON compatibility layer")
Signed-off-by: Michał Mirosław <mirq-linux@...e.qmqm.pl>
---
v2: split parameter checking to separate patch
---
 drivers/power/supply/power_supply_hwmon.c | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/drivers/power/supply/power_supply_hwmon.c b/drivers/power/supply/power_supply_hwmon.c
index 75cf861ba492..67b6ee60085e 100644
--- a/drivers/power/supply/power_supply_hwmon.c
+++ b/drivers/power/supply/power_supply_hwmon.c
@@ -144,7 +144,7 @@ static int power_supply_hwmon_read_string(struct device *dev,
 					  u32 attr, int channel,
 					  const char **str)
 {
-	*str = channel ? "temp" : "temp ambient";
+	*str = channel ? "temp ambient" : "temp";
 	return 0;
 }
 
-- 
2.20.1

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