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Date:   Wed, 6 May 2020 15:20:30 +0000
From:   Amir Mizinski <>
To:     Rob Herring <>
Subject: Re: [PATCH v7 6/7] tpm: Add YAML schema for TPM TIS I2C options

On 2020-05-05 16:12, Rob Herring wrote:
> On Mon, Apr 27, 2020 at 03:49:30PM +0300, wrote:
>> From: Amir Mizinski <>
>> Added a YAML schema to support tpm tis i2c related dt-bindings for the I2c
>> PTP based physical layer.
>> This patch adds the documentation for corresponding device tree bindings of
>> I2C based Physical TPM.
>> Refer to the 'I2C Interface Definition' section in
>> 'TCG PC Client PlatformTPMProfile(PTP) Specification' publication
>> for specification.
> Again, DT bindings describe h/w devices, not just a protocol. A device
> is more than just a protocol interface. There's clocks, power rails,
> resets, interrupts, firmware, etc.
> Unless there's something special about TPM chips that makes none of this
> applicable and no chip will ever have any quirks (or extensions) in
> their protocol to work-around, then you need compatible string(s) that
> are specific to the TPM chip. You can have tcg,tpm-tis-i2c as a
> fallback, but you need specific compatible to handle any quirks.
> Rob

Hello Rob, currently yes. All TPM chip are implemented according to the TGC specs and should use the same properties for this I2C driver.
I can't say for sure that it will be the case in the future. Shouldn't we use the standard "tcg,tpm-tis-i2c" compatible, and if a specific TPM chip will deviate from the specs, the vendor should add an additional compatible string for it?
Thank you,

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