linux-kernel - Re: [PATCH v6 0/6] Introduce Power domain based warming device driver

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Message-ID: <20200616105325.GH1718@bug>
Date:   Tue, 16 Jun 2020 12:53:25 +0200
From:   Pavel Machek <pavel@....cz>
To:     Thara Gopinath <thara.gopinath@...aro.org>
Cc:     rui.zhang@...el.com, ulf.hansson@...aro.org,
        daniel.lezcano@...aro.org, bjorn.andersson@...aro.org,
        agross@...nel.org, robh@...nel.org, amit.kucheria@...durent.com,
        mark.rutland@....com, rjw@...ysocki.net, linux-pm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-arm-msm@...r.kernel.org,
        linux-kernel@...r.kernel.org
Subject: Re: [PATCH v6 0/6] Introduce Power domain based warming device driver

Hi!

> Certain resources modeled as a generic power domain in linux kernel can be
> used to warm up the SoC (mx power domain on sdm845) if the temperature
> falls below certain threshold. These power domains can be considered as
> thermal warming devices.  (opposite of thermal cooling devices).

Would you explain when this is needed?

I'd normally expect "too low" temperature to be a problem during power-on, but at
that time Linux is not running so it can not provide the heating...

Best regards,

									Pavel
-- 
(english) http://www.livejournal.com/~pavelmachek
(cesky, pictures) http://atrey.karlin.mff.cuni.cz/~pavel/picture/horses/blog.html