linux-kernel - Re: [PATCH v11 2/3] ASoC: qcom: dt-bindings: Add sc7180 machine bindings

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Message-ID: <CAFv8NwJ-+f146Ss9Mk=nEXjm1B--ZwhAgnfx-cTi7DGEKqC1-Q@mail.gmail.com>
Date:   Wed, 21 Oct 2020 02:54:43 +0800
From:   Cheng-yi Chiang <cychiang@...omium.org>
To:     Srinivas Kandagatla <srinivas.kandagatla@...aro.org>
Cc:     Mark Brown <broonie@...nel.org>,
        linux-kernel <linux-kernel@...r.kernel.org>,
        Taniya Das <tdas@...eaurora.org>,
        Rohit kumar <rohitkr@...eaurora.org>,
        Banajit Goswami <bgoswami@...eaurora.org>,
        Patrick Lai <plai@...eaurora.org>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <bjorn.andersson@...aro.org>,
        Liam Girdwood <lgirdwood@...il.com>,
        Rob Herring <robh+dt@...nel.org>,
        Jaroslav Kysela <perex@...ex.cz>,
        Takashi Iwai <tiwai@...e.com>,
        Stephan Gerhold <stephan@...hold.net>,
        Matthias Brugger <matthias.bgg@...il.com>,
        Heiko Stuebner <heiko@...ech.de>,
        Srinivasa Rao <srivasam@...eaurora.org>,
        Doug Anderson <dianders@...omium.org>,
        Dylan Reid <dgreid@...omium.org>,
        Tzung-Bi Shih <tzungbi@...omium.org>,
        Linux ARM <linux-arm-kernel@...ts.infradead.org>,
        linux-arm-msm <linux-arm-msm@...r.kernel.org>,
        Kuninori Morimoto <kuninori.morimoto.gx@...esas.com>,
        "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" 
        <devicetree@...r.kernel.org>,
        "moderated list:SOUND - SOC LAYER / DYNAMIC AUDIO POWER MANAGEM..." 
        <alsa-devel@...a-project.org>,
        "moderated list:ARM/Mediatek SoC support" 
        <linux-mediatek@...ts.infradead.org>,
        "open list:ARM/Rockchip SoC..." <linux-rockchip@...ts.infradead.org>,
        Ajye Huang <ajye_huang@...pal.corp-partner.google.com>
Subject: Re: [PATCH v11 2/3] ASoC: qcom: dt-bindings: Add sc7180 machine bindings

On Tue, Oct 20, 2020 at 10:55 PM Srinivas Kandagatla
<srinivas.kandagatla@...aro.org> wrote:
>
>
>
> On 20/10/2020 15:37, Mark Brown wrote:
> > I don't understand what "logic scattered in various dtsi files" means,
> > sorry.
> >
> >> Yes, that should work to describe the dailink we are using.
> >> But a more tricky issue is how to do calls like setting PLL in dai startup ops.
> > ...
> >
> >> I think that asking a generic machine driver to do configuration like
> >> this with only a limited interface of device property
> >> might be too much of an ask for the machine driver.
> > Richard was looking at some basic configuration for PLLs.
> >
> >> Would you mind if I simplify the compatible string like Srinivas
> >> suggested, and send a v12?
> >> As for other two kinds of variations that I am aware of:
> >> 1. front mic / rear mic
> >> 2. replace alc5682 with adau7002
> > The CODEC change is going to be described in the DT no matter what -
> > you'll have a reference to the CODEC node but it may make sense if
> > there's enough custom code around it.  For front vs rear mic the
> > simplest thing would just be to not mention which if this is a hardware
> > fixed thing, otherwise a control.
> >
> >> We can set different board names and different compatible strings to
> >> achieve such variation.
> >> So that it would make sense to describe configuration in compatible
> >> strings like you suggested, and also provides UCM a way to distinguish
> >> different boards.
> > I don't recall having suggested distinguishing these things with a
> > compatible string, especially not the microphones.  UCM can already use
> > the display names for the boards to distinguish things.
>
>
> Not with the compatible string!
>
> Currently card name, and long name are exactly same in all Qualcomm
> soundcards, which makes it very difficult to identify how those boards
> re wired up at UCM2 level. So the plan is to properly populate card long
> name with "model" property which can include details on how things are
> wiredup on that board.
>
> --srini

Hi Srini,
Thanks for taking a look.
Let me try to clarify your comments in case there is any misunderstanding.

I understand your request on having different board variations using
different sound card names through model property, and I totally agree
with that.
As for compatible strings, do you insist on having all the board
variations using exactly the same compatible string ?

Thanks!