linux-kernel - Re: [PATCH] mtd: spi-nor: winbond: Add support for w25m512jw

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Date:   Mon, 7 Dec 2020 17:26:57 +0000
From:   <Tudor.Ambarus@...rochip.com>
To:     <prabhakar.mahadev-lad.rj@...renesas.com>,
        <miquel.raynal@...tlin.com>, <richard@....at>, <vigneshr@...com>,
        <linux-mtd@...ts.infradead.org>,
        <linux-renesas-soc@...r.kernel.org>
CC:     <linux-kernel@...r.kernel.org>, <prabhakar.csengg@...il.com>,
        <biju.das.jz@...renesas.com>
Subject: Re: [PATCH] mtd: spi-nor: winbond: Add support for w25m512jw

Hi, Lad,

On 10/16/20 2:55 PM, Lad Prabhakar wrote:
> EXTERNAL EMAIL: Do not click links or open attachments unless you know the content is safe
> 
> This chip is (nearly) identical to the Winbond w25m512jv which is
> already supported by Linux. Compared to the w25m512jv, the 'jw'
> has a different JEDEC ID.

W25M512JW-IQ (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory,
introduces a new “Software Die Select (C2h)” instruction, which we don't
support. I guess you can't access the second die with what we have in
mainline. Or am I wrong? We'll need to add support for multi-die support
if we want to add new multi-die flashes.

ta