linux-kernel - Re: [PATCH v4 0/5] Thermal devfreq cooling improvements with Energy Model

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Message-ID: <20b01b9a-3ec6-4521-bcd1-a218199e1732@arm.com>
Date:   Fri, 11 Dec 2020 15:29:28 +0000
From:   Lukasz Luba <lukasz.luba@....com>
To:     Daniel Lezcano <daniel.lezcano@...aro.org>
Cc:     linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        dri-devel@...ts.freedesktop.org, rui.zhang@...el.com,
        amit.kucheria@...durent.com, orjan.eide@....com, robh@...nel.org,
        alyssa.rosenzweig@...labora.com, steven.price@....com,
        airlied@...ux.ie, daniel@...ll.ch, ionela.voinescu@....com
Subject: Re: [PATCH v4 0/5] Thermal devfreq cooling improvements with Energy
 Model



On 12/11/20 3:15 PM, Daniel Lezcano wrote:
> On 11/12/2020 16:11, Lukasz Luba wrote:
>> Hi Daniel,
>>
>> Do you think it has chance to go to as material for v5.11?
> 
> Yes, it is in the thermal/linux-next material ATM.

Thank you!

Regards,
Lukasz