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Date:   Mon, 15 Mar 2021 14:09:46 +0800
From:   Shawn Guo <shawnguo@...nel.org>
To:     Sebastian Reichel <sebastian.reichel@...labora.com>
Cc:     Sascha Hauer <s.hauer@...gutronix.de>,
        Pengutronix Kernel Team <kernel@...gutronix.de>,
        Fabio Estevam <festevam@...il.com>,
        NXP Linux Team <linux-imx@....com>,
        Rob Herring <robh+dt@...nel.org>, devicetree@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
        kernel@...labora.com
Subject: Re: [PATCHv2 0/4] Bx50v3 DT improvements

On Mon, Mar 08, 2021 at 04:18:25PM +0100, Sebastian Reichel wrote:
> Bx50v3 DT improvements
> 
> These are a bunch of small unrelated improvements for the GE Bx50v3
> device tree (and BA16 system on module, which is currently only used
> by Bx50v3).
> 
> Changes since PATCHv1 [1]:
>  * change patch prefix for BA16 patches
>  * remove extra newline from PATCH 1/4
>  * keep 'status' at the end of FEC in PATCH 2/4
> 
> [1] https://lore.kernel.org/lkml/20210223183346.138575-1-sebastian.reichel@collabora.com/
> 
> Thanks for reviewing/merging them,
> 
> -- Sebastian
> 
> Ian Ray (1):
>   ARM: dts: imx: bx50v3: Define GPIO line names
> 
> Sebastian Reichel (3):
>   ARM: dts: imx6q-ba16: add USB OTG VBUS enable GPIO
>   ARM: dts: imx6q-ba16: improve PHY information
>   ARM: dts: imx: bx50v3: i2c GPIOs are open drain

Applied all, thanks.

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