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Message-ID: <fafa8304-2445-8413-b98c-8269ee033776@somainline.org>
Date: Sat, 20 Mar 2021 20:48:29 +0100
From: Konrad Dybcio <konrad.dybcio@...ainline.org>
To: Daniel Lezcano <daniel.lezcano@...aro.org>,
~postmarketos/upstreaming@...ts.sr.ht
Cc: martin.botka@...ainline.org,
angelogioacchino.delregno@...ainline.org,
marijn.suijten@...ainline.org, Amit Kucheria <amitk@...nel.org>,
Andy Gross <agross@...nel.org>,
Bjorn Andersson <bjorn.andersson@...aro.org>,
Zhang Rui <rui.zhang@...el.com>,
Rob Herring <robh+dt@...nel.org>, linux-pm@...r.kernel.org,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org
Subject: Re: [RESEND PATCH v4 1/2] dt-bindings: tsens: qcom: Document MDM9607
compatible
On 20.03.2021 20:47, Daniel Lezcano wrote:
> On 20/03/2021 20:01, Konrad Dybcio wrote:
>> Add the compatible for MDM9607.
>>> Signed-off-by: Konrad Dybcio <konrad.dybcio@...ainline.org>
>>> ---
>>> v4: separate from the main patch
>>>
>>> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 2 ++
>>> 1 file changed, 2 insertions(+)
>> This change was previously a-b Rob Herring, I forgot to add the ack back in after separating the patch, sorry for that.
> Can you point it to a lkml@ archive ?
>
Sure, it's been acked here [1].
[1] https://lore.kernel.org/patchwork/patch/1372052/
Konrad
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