linux-kernel - Re: [PATCH v3 1/2] dt-bindings: thermal: qcom-tsens: Add compatible for sm8350

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Date:   Sat, 27 Mar 2021 09:19:48 -0600
From:   Rob Herring <robh@...nel.org>
To:     Robert Foss <robert.foss@...aro.org>
Cc:     linux-arm-msm@...r.kernel.org, bjorn.andersson@...aro.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        Vinod Koul <vkoul@...nel.org>, amitk@...nel.org,
        Konrad Dybcio <konrad.dybcio@...ainline.org>,
        rui.zhang@...el.com, Vinod Koul <vinod.koul@...aro.org>,
        daniel.lezcano@...aro.org, linux-pm@...r.kernel.org,
        agross@...nel.org, robh+dt@...nel.org
Subject: Re: [PATCH v3 1/2] dt-bindings: thermal: qcom-tsens: Add compatible
 for sm8350

On Wed, 24 Mar 2021 13:43:08 +0100, Robert Foss wrote:
> Add tsens bindings for sm8350.
> 
> Signed-off-by: Robert Foss <robert.foss@...aro.org>
> Reviewed-by: Vinod Koul <vkoul@...nel.org>
> ---
> 
> Changes since v1:
>  - Vinod: Remove comment
> 
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Acked-by: Rob Herring <robh@...nel.org>