linux-kernel - [PATCH -next] thermal: thermal_of: Correct struct name __thermal_bind

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Message-ID: <20210518131408.1310057-1-yangyingliang@huawei.com>
Date:   Tue, 18 May 2021 21:14:08 +0800
From:   Yang Yingliang <yangyingliang@...wei.com>
To:     <linux-kernel@...r.kernel.org>, <linux-pm@...r.kernel.org>
CC:     <amitk@...nel.org>, <daniel.lezcano@...aro.org>
Subject: [PATCH -next] thermal: thermal_of: Correct struct name __thermal_bind_params

Fix the following make W=1 kernel build warning:

   drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead

Signed-off-by: Yang Yingliang <yangyingliang@...wei.com>
---
 drivers/thermal/thermal_of.c | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/drivers/thermal/thermal_of.c b/drivers/thermal/thermal_of.c
index 5b76f9a1280d..e86389fa1431 100644
--- a/drivers/thermal/thermal_of.c
+++ b/drivers/thermal/thermal_of.c
@@ -35,7 +35,7 @@ struct __thermal_cooling_bind_param {
 };
 
 /**
- * struct __thermal_bind_param - a match between trip and cooling device
+ * struct __thermal_bind_params - a match between trip and cooling device
  * @tcbp: a pointer to an array of cooling devices
  * @count: number of elements in array
  * @trip_id: the trip point index
-- 
2.25.1