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Message-Id: <CBRHJM8ANOSE.2Q5C1FVQS5QOA@shaak>
Date: Mon, 31 May 2021 10:03:23 -0400
From: "Liam Beguin" <liambeguin@...il.com>
To: "Peter Rosin" <peda@...ntia.se>, <jic23@...nel.org>,
<lars@...afoo.de>, <pmeerw@...erw.net>
Cc: <linux-kernel@...r.kernel.org>, <linux-iio@...r.kernel.org>,
<devicetree@...r.kernel.org>, <robh+dt@...nel.org>
Subject: Re: [PATCH v1 9/9] dt-bindings: iio: afe: add binding for
temperature-sense-amplifier
Hi Peter,
On Mon May 31, 2021 at 3:32 AM EDT, Peter Rosin wrote:
> Hi!
>
> On 2021-05-30 02:59, Liam Beguin wrote:
> > From: Liam Beguin <lvb@...hos.com>
> >
> > An ADC is often used to measure other quantities indirectly. This
> > binding describe one cases, the measurement of a temperature through a
> > voltage sense amplifier such as the LTC2997.
> >
> > Signed-off-by: Liam Beguin <lvb@...hos.com>
>
> What's the significant difference between this and the RTD binding? Does
> not both simply scale/offset a voltage to a temperature?
>
The way I looked at it was one binding per sensor type (resistance
driven, current driven, and voltage driven).
Thinking about it more, these three bindings could be factorized into
one if the user is required to enter parameters "by hand".
These could become something like:
- sense-gain-mult
- sense-gain-div
- sense-offset
I like the idea of having the "datasheet parameters" in the devicetree,
but this would be a lot more versatile.
What do you think?
Cheers,
Liam
> Cheers,
> Peter
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