linux-kernel - Re: [PATCH] dt-bindings: thermal: tsens: Add sc8180x compatible

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Message-ID: <20210618205926.GA2864590@robh.at.kernel.org>
Date:   Fri, 18 Jun 2021 14:59:26 -0600
From:   Rob Herring <robh@...nel.org>
To:     Bjorn Andersson <bjorn.andersson@...aro.org>
Cc:     Rob Herring <robh+dt@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Andy Gross <agross@...nel.org>, devicetree@...r.kernel.org,
        linux-pm@...r.kernel.org, linux-arm-msm@...r.kernel.org,
        Zhang Rui <rui.zhang@...el.com>, linux-kernel@...r.kernel.org,
        Thara Gopinath <thara.gopinath@...aro.org>,
        Amit Kucheria <amitk@...nel.org>
Subject: Re: [PATCH] dt-bindings: thermal: tsens: Add sc8180x compatible

On Tue, 08 Jun 2021 13:16:38 -0700, Bjorn Andersson wrote:
> The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
> for this.
> 
> Signed-off-by: Bjorn Andersson <bjorn.andersson@...aro.org>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Acked-by: Rob Herring <robh@...nel.org>