linux-kernel - Re: [PATCH 05/10] dt-bindings: thermal: tsens: Add SM6350 compatible

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Date:   Wed, 15 Dec 2021 14:10:19 -0600
From:   Rob Herring <robh@...nel.org>
To:     Luca Weiss <luca.weiss@...rphone.com>
Cc:     Konrad Dybcio <konrad.dybcio@...ainline.org>,
        Rob Herring <robh+dt@...nel.org>,
        ~postmarketos/upstreaming@...ts.sr.ht,
        linux-arm-msm@...r.kernel.org,
        Bjorn Andersson <bjorn.andersson@...aro.org>,
        Amit Kucheria <amitk@...nel.org>, linux-kernel@...r.kernel.org,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>, devicetree@...r.kernel.org,
        Thara Gopinath <thara.gopinath@...aro.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        linux-pm@...r.kernel.org, phone-devel@...r.kernel.org,
        Andy Gross <agross@...nel.org>
Subject: Re: [PATCH 05/10] dt-bindings: thermal: tsens: Add SM6350 compatible

On Mon, 13 Dec 2021 09:26:06 +0100, Luca Weiss wrote:
> Add devicetree compatible for tsens on SM6350 SoC.
> 
> Signed-off-by: Luca Weiss <luca.weiss@...rphone.com>
> Acked-by: Konrad Dybcio <konrad.dybcio@...ainline.org>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Acked-by: Rob Herring <robh@...nel.org>