linux-kernel - [RFC PATCH v3 3/5] thermal: Add interface to cooling devices to handle governor change

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Message-Id: <20220406220809.22555-4-lukasz.luba@arm.com>
Date:   Wed,  6 Apr 2022 23:08:07 +0100
From:   Lukasz Luba <lukasz.luba@....com>
To:     linux-kernel@...r.kernel.org
Cc:     lukasz.luba@....com, dietmar.eggemann@....com,
        viresh.kumar@...aro.org, rafael@...nel.org,
        daniel.lezcano@...aro.org, amitk@...nel.org, rui.zhang@...el.com,
        amit.kachhap@...il.com, linux-pm@...r.kernel.org
Subject: [RFC PATCH v3 3/5] thermal: Add interface to cooling devices to handle governor change

Add interface to cooling devices to handle governor change, to better
setup internal needed structures or to cleanup them. This interface is
going to be used by thermal governor Intelligent Power Allocation (IPA).
which requires to setup monitoring mechanism in the cpufreq cooling
devices.

Signed-off-by: Lukasz Luba <lukasz.luba@....com>
---
 include/linux/thermal.h | 1 +
 1 file changed, 1 insertion(+)

diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index c314893970b3..baaa84d989bd 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -87,6 +87,7 @@ struct thermal_cooling_device_ops {
 	int (*get_requested_power)(struct thermal_cooling_device *, u32 *);
 	int (*state2power)(struct thermal_cooling_device *, unsigned long, u32 *);
 	int (*power2state)(struct thermal_cooling_device *, u32, unsigned long *);
+	int (*change_governor)(struct thermal_cooling_device *cdev, bool set);
 };
 
 struct thermal_cooling_device {
-- 
2.17.1