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Message-ID: <YnLdxF+P7hWwjgZS@robh.at.kernel.org>
Date: Wed, 4 May 2022 15:10:44 -0500
From: Rob Herring <robh@...nel.org>
To: Robert Marko <robimarko@...il.com>
Cc: amitk@...nel.org, thara.gopinath@...aro.org, agross@...nel.org,
bjorn.andersson@...aro.org, rafael@...nel.org,
daniel.lezcano@...aro.org, rui.zhang@...el.com,
krzysztof.kozlowski+dt@...aro.org, linux-pm@...r.kernel.org,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org,
Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
Subject: Re: [PATCH v4 1/5] dt-bindings: thermal: tsens: Add ipq8074
compatible
On Tue, May 03, 2022 at 10:08:09PM +0200, Robert Marko wrote:
> Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
> only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
>
> We also have to make sure that correct interrupts are set according to
> compatibles, so populate interrupt information per compatibles.
>
> Signed-off-by: Robert Marko <robimarko@...il.com>
> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> ---
> Changes in v4:
> * Add the forgotten Reviewed-by tag from Krzysztof
>
> Changes in v3:
> * Remove implied min/maxItem properties as pointed by Rob
>
> Changes in v2:
> * No need for a list in compatible check
> * Specify minItems and maxItems for interrupt and interrupt-names
> ---
> .../bindings/thermal/qcom-tsens.yaml | 76 ++++++++++++++++---
> 1 file changed, 65 insertions(+), 11 deletions(-)
Reviewed-by: Rob Herring <robh@...nel.org>
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