linux-kernel - Re: [PATCH v2] dt-bindings: thermal: tsens: Add sc8280xp compatible

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Message-ID: <49f1e84f-3769-ae8f-b8de-4a5315110f5d@linaro.org>
Date:   Mon, 9 May 2022 12:07:01 +0200
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     Bjorn Andersson <bjorn.andersson@...aro.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>
Cc:     Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        linux-pm@...r.kernel.org, linux-arm-msm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
Subject: Re: [PATCH v2] dt-bindings: thermal: tsens: Add sc8280xp compatible

On 03/05/2022 17:34, Bjorn Andersson wrote:
> The Qualcomm SC8280XP platform has three instances of the tsens block,
> add a compatible for these instances.
> 
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> Signed-off-by: Bjorn Andersson <bjorn.andersson@...aro.org>
> ---

Applied, thanks


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