linux-kernel - [PATCH 5.17 420/772] thermal/core: Fix memory leak in __thermal_cooling_device

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Message-Id: <20220607165001.382322139@linuxfoundation.org>
Date:   Tue,  7 Jun 2022 19:00:12 +0200
From:   Greg Kroah-Hartman <gregkh@...uxfoundation.org>
To:     linux-kernel@...r.kernel.org
Cc:     Greg Kroah-Hartman <gregkh@...uxfoundation.org>,
        stable@...r.kernel.org, Hulk Robot <hulkci@...wei.com>,
        Yang Yingliang <yangyingliang@...wei.com>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Sasha Levin <sashal@...nel.org>
Subject: [PATCH 5.17 420/772] thermal/core: Fix memory leak in __thermal_cooling_device_register()

From: Yang Yingliang <yangyingliang@...wei.com>

[ Upstream commit 98a160e898c0f4a979af9de3ab48b4b1d42d1dbb ]

I got memory leak as follows when doing fault injection test:

unreferenced object 0xffff888010080000 (size 264312):
  comm "182", pid 102533, jiffies 4296434960 (age 10.100s)
  hex dump (first 32 bytes):
    00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00  .....N..........
    ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff  ........@.......
  backtrace:
    [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969
    [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510
    [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586
    [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927
    [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041
    [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211
    [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561

If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called
to free the memory allocated in thermal_cooling_device_setup_sysfs().

Fixes: 8ea229511e06 ("thermal: Add cooling device's statistics in sysfs")
Reported-by: Hulk Robot <hulkci@...wei.com>
Signed-off-by: Yang Yingliang <yangyingliang@...wei.com>
Link: https://lore.kernel.org/r/20220511020605.3096734-1-yangyingliang@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@...aro.org>
Signed-off-by: Sasha Levin <sashal@...nel.org>
---
 drivers/thermal/thermal_core.c | 1 +
 1 file changed, 1 insertion(+)

diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c
index 82654dc8382b..cdc0552e8c42 100644
--- a/drivers/thermal/thermal_core.c
+++ b/drivers/thermal/thermal_core.c
@@ -947,6 +947,7 @@ __thermal_cooling_device_register(struct device_node *np,
 	return cdev;
 
 out_kfree_type:
+	thermal_cooling_device_destroy_sysfs(cdev);
 	kfree(cdev->type);
 	put_device(&cdev->device);
 	cdev = NULL;
-- 
2.35.1