linux-kernel - Re: [PATCH v3 00/32] New thermal OF code

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Date:   Tue, 16 Aug 2022 14:52:03 +0200
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     "Rafael J. Wysocki" <rafael@...nel.org>
Cc:     Daniel Lezcano <daniel.lezcano@...exp.org>,
        "Zhang, Rui" <rui.zhang@...el.com>,
        Linux PM <linux-pm@...r.kernel.org>,
        Linux Kernel Mailing List <linux-kernel@...r.kernel.org>,
        Kevin Hilman <khilman@...libre.com>,
        Alexandre Bailon <abailon@...libre.com>,
        Lukasz Luba <lukasz.luba@....com>,
        Mark Brown <broonie@...nel.org>,
        damien.lemoal@...nsource.wdc.com, Heiko Stuebner <heiko@...ech.de>,
        Kunihiko Hayashi <hayashi.kunihiko@...ionext.com>,
        mhiramat@...nel.org, Talel Shenhar <talel@...zon.com>,
        Thierry Reding <thierry.reding@...il.com>,
        Dmitry Osipenko <digetx@...il.com>,
        Jon Hunter <jonathanh@...dia.com>, anarsoul@...il.com,
        Yangtao Li <tiny.windzz@...il.com>,
        Baolin Wang <baolin.wang7@...il.com>,
        Florian Fainelli <f.fainelli@...il.com>,
        Bjorn Andersson <bjorn.andersson@...aro.org>,
        Maxime Coquelin <mcoquelin.stm32@...il.com>,
        glaroque@...libre.com, Miquel Raynal <miquel.raynal@...tlin.com>,
        Shawn Guo <shawnguo@...nel.org>,
        Niklas Söderlund <niklas.soderlund@...natech.se>,
        Matthias Brugger <matthias.bgg@...il.com>,
        Keerthy <j-keerthy@...com>
Subject: Re: [PATCH v3 00/32] New thermal OF code

On 16/08/2022 14:40, Rafael J. Wysocki wrote:
> On Mon, Aug 15, 2022 at 9:02 PM Daniel Lezcano
> <daniel.lezcano@...aro.org> wrote:
>>
>>
>> Hi Rafael,
>>
>> On 28/07/2022 16:37, Rafael J. Wysocki wrote:
>>> Hi Daniel,
>>>
>>> On Wed, Jul 27, 2022 at 11:46 PM Daniel Lezcano
>>> <daniel.lezcano@...aro.org> wrote:
>>>>
>>>>
>>>> Hi Rafael,
>>>>
>>>> we are close to release v5.19.
>>>>
>>>> I want to send a PR this week but it would be nice if this series could
>>>> be part of it, so the trip point rework we discussed earlier (it is a
>>>> long series) could be merged more easily for v5.21-rc1 as it will depend
>>>> on these changes.
>>>>
>>>> This series was tested on different platforms, rk3399, broadcom and
>>>> rcar. The external drivers as ata, touchscreen, regulator, hwmon were
>>>> acked/reviewed and some other thermal drivers reviewed also. Some others
>>>> remain without feedback because the maintainer is unresponsive or the
>>>> driver is orphaned, falling under the thermal framework maintenance
>>>> umbrella. All the drivers changes are the same.
>>>>
>>>> I do believe it does a nice cleanup and consolidation of the OF thermal
>>>> code and realign it with the core thermal framework.
>>>>
>>>> Is it ok to merge the series?
>>>
>>> I would prefer to put it into linux-next for a few days.
>>>
>>> Why don't you send 2 pull requests, one with all of the other material
>>> you have for 5.20 and another one with this series (it may be on top
>>> of the first one)?
>>>
>>> I will be able to defer pushing the second one till the second half of
>>> the merge window.
>>
>> I setup a branch with the patches and the fixes.
>>
>> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/v6.0-rc1-2
>>
>> Is there still time for a PR ?
> 
> Not for 6.0-rc.


Ok, I'll setup a signed tag for the 'fixes' branch.


> I'm out of office this week, but I'll gladly merge an early PR for 6.1
> next week.

Ok, sounds good, thanks

   -- Daniel


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