linux-kernel - [PATCH 0/4] thermal: Introduce Qualcomm Cooling Driver suppport

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Date:   Mon, 12 Sep 2022 14:20:45 +0530
From:   Bhupesh Sharma <bhupesh.sharma@...aro.org>
To:     linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        devicetree@...r.kernel.org
Cc:     agross@...nel.org, linux-arm-msm@...r.kernel.org,
        daniel.lezcano@...aro.org, robh@...nel.org, andersson@...nel.org,
        rafael@...nel.org, bhupesh.sharma@...aro.org,
        bhupesh.linux@...il.com
Subject: [PATCH 0/4] thermal: Introduce Qualcomm Cooling Driver suppport

This patchset introduces the Qualcomm Cooling Driver (aka Qualcomm Thermal
Mitigation Driver) and the related support code (dt-binding, MAINTAINER
file etc).

Several Qualcomm Snapdragon SoCs have Thermal Mitigation Devices (TMDs)
present on various remote subsystem(s) (for e.g. the Compute DSP, aka cDSP),
which can be used for several mitigations for remote subsystem(s), including
remote processor mitigation, rail voltage restriction etc. 

Here we introduce the Qualcomm Cooling Driver which is based on the
kernel thermal driver framework and also employs the kernel QMI interface
to send the message to remote subsystem(s).

At the very top-level, the dts is supposed to describe a TMD node, which
should further represent the remote subsystem(s) present on the SoC and
further each child of a subsystem should represent the separate cooling devices
available on the remote subsystem.

Note that this patchset is targeted for the 'linux-pm' tree and the dts
patchset/changes targeted for 'linux-arm-msm' tree will be sent as a
separate patchset.

This patchset is based on the CONFIG_QCOM_THERMAL related fix sent via
[1]. Otherwise the latest changes from 'linux-next/master' are used to
rebase the patchset.

[1]. https://lore.kernel.org/all/CAA8EJpoM5nW=pVJB4zy4Jh9Q3gE4KOju2QVy_WtmUokKMyXtuw@mail.gmail.com/T/#m4e2b765e68e3123b3c0e28c806409dae4b988432

Cc: andersson@...nel.org
Cc: robh@...nel.org
Cc: daniel.lezcano@...aro.org
Cc: rafael@...nel.org

Bhupesh Sharma (4):
  thermal: qcom: qmi_cooling: Add skeletal qmi cooling driver
  thermal: qcom: Add Kconfig entry & compilation support for qmi cooling
    driver
  dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml
    bindings
  MAINTAINERS: Add entry for Qualcomm Cooling Driver

 .../bindings/thermal/qcom,qmi-tmd-device.yaml |  78 +++
 .../bindings/thermal/qcom,tmd-device.yaml     | 122 ++++
 MAINTAINERS                                   |  10 +
 drivers/thermal/qcom/Kconfig                  |   4 +
 drivers/thermal/qcom/Makefile                 |   2 +
 drivers/thermal/qcom/qmi_cooling/Kconfig      |  14 +
 drivers/thermal/qcom/qmi_cooling/Makefile     |   3 +
 .../qcom/qmi_cooling/qcom_qmi_cooling.c       | 632 ++++++++++++++++++
 .../qcom/qmi_cooling/qcom_tmd_services.c      | 352 ++++++++++
 .../qcom/qmi_cooling/qcom_tmd_services.h      | 120 ++++
 include/dt-bindings/thermal/qcom,tmd.h        |  14 +
 11 files changed, 1351 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
 create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
 create mode 100644 drivers/thermal/qcom/qmi_cooling/Kconfig
 create mode 100644 drivers/thermal/qcom/qmi_cooling/Makefile
 create mode 100644 drivers/thermal/qcom/qmi_cooling/qcom_qmi_cooling.c
 create mode 100644 drivers/thermal/qcom/qmi_cooling/qcom_tmd_services.c
 create mode 100644 drivers/thermal/qcom/qmi_cooling/qcom_tmd_services.h
 create mode 100644 include/dt-bindings/thermal/qcom,tmd.h

-- 
2.37.1