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Message-ID: <20220912155820.GA1362480-robh@kernel.org>
Date: Mon, 12 Sep 2022 10:58:20 -0500
From: Rob Herring <robh@...nel.org>
To: Bhupesh Sharma <bhupesh.sharma@...aro.org>
Cc: linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
devicetree@...r.kernel.org, agross@...nel.org,
linux-arm-msm@...r.kernel.org, daniel.lezcano@...aro.org,
andersson@...nel.org, rafael@...nel.org, bhupesh.linux@...il.com
Subject: Re: [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and
qcom,tmd-device yaml bindings
On Mon, Sep 12, 2022 at 02:20:48PM +0530, Bhupesh Sharma wrote:
> Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings.
>
> Qualcomm QMI based TMD cooling device(s) are used for various
> mitigations for remote subsystem(s) including remote processor
> mitigation, rail voltage restriction etc.
>
> Each child node represents one remote subsystem and each child
> of this subsystem in-turn represents separate TMD cooling device.
>
> Cc: daniel.lezcano@...aro.org
> Cc: rafael@...nel.org
> Cc: andersson@...nel.org
> Cc: robh@...nel.org
> Signed-off-by: Bhupesh Sharma <bhupesh.sharma@...aro.org>
> ---
> .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++
> .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++
> include/dt-bindings/thermal/qcom,tmd.h | 14 ++
> 3 files changed, 214 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
> create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
> create mode 100644 include/dt-bindings/thermal/qcom,tmd.h
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
> new file mode 100644
> index 000000000000..dfda5b611a93
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
> @@ -0,0 +1,78 @@
> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> +
> +%YAML 1.2
> +---
> +$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#"
> +$schema: "http://devicetree.org/meta-schemas/core.yaml#"
> +
> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices.
> +
> +maintainers:
> + - Bhupesh Sharma <bhupesh.sharma@...aro.org>
> +
> +description:
> + Qualcomm QMI based TMD cooling device(s) are used for various
> + mitigations for remote subsystem(s) including remote processor
> + mitigation, rail voltage restriction etc.
> +
> +properties:
> + $nodename:
> + const: qmi-tmd-devices
> +
> + compatible:
> + items:
> + - const: qcom,qmi-tmd-devices
> +
> + modem0:
> + $ref: /schemas/thermal/qcom,tmd-device.yaml#
> +
> + adsp:
> + $ref: /schemas/thermal/qcom,tmd-device.yaml#
> +
> + cdsp:
> + $ref: /schemas/thermal/qcom,tmd-device.yaml#
> +
> + slpi:
> + $ref: /schemas/thermal/qcom,tmd-device.yaml#
> +
> +required:
> + - compatible
> +
> +unevaluatedProperties: false
> +
> +examples:
> + - |
> + #include <dt-bindings/thermal/qcom,tmd.h>
> + qmi-tmd-devices {
> + compatible = "qcom,qmi-tmd-devices";
> +
> + modem0 {
> + qcom,instance-id = <MODEM0_INSTANCE_ID>;
> +
> + modem0_pa: tmd-device0 {
> + label = "pa";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_proc: tmd-device1 {
> + label = "modem";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_current: tmd-device2 {
> + label = "modem_current";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_skin: tmd-device3 {
> + label = "modem_skin";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_vdd: tmd-device4 {
> + label = "cpuv_restriction_cold";
> + #cooling-cells = <2>;
> + };
> + };
> + };
> +...
> diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
> new file mode 100644
> index 000000000000..38ac62f03376
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
> @@ -0,0 +1,122 @@
> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
> +
> +%YAML 1.2
> +---
> +$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#"
> +$schema: "http://devicetree.org/meta-schemas/core.yaml#"
> +
> +title: Qualcomm thermal mitigation (TMD) cooling devices
> +
> +maintainers:
> + - Bhupesh Sharma <bhupesh.sharma@...aro.org>
> +
> +description:
> + Qualcomm thermal mitigation (TMD) cooling devices. Each child node
> + represents one remote subsystem and each child of this subsystem in-turn
> + represents separate cooling devices.
> +
> +properties:
> + $nodename:
> + pattern: "^(modem|adsp|cdsp|slpi[0-9])?$"
Node names are supposed to reflect the class of device, not instance.
> +
> + qcom,instance-id:
> + $ref: /schemas/types.yaml#/definitions/uint32
> + description:
> + Remote subsystem QMI server instance id to be used for communicating with QMI.
In general, we don't do instance indexes in DT. You'll need to explain
where the value comes from.
> +
> +patternProperties:
> + "^tmd-device[0-9]?$":
A cooling provider should have a standard node name. Not sure offhand if
we defined one in the spec or not yet.
> + type: object
> + description:
> + Subnodes indicating tmd cooling device of a specific category.
> + properties:
> + label:
> + maxItems: 1
> + description: |
> + Remote subsystem device identifier. Acceptable device names -
> + "pa" -> for pa cooling device,
> + "cpuv_restriction_cold" -> for vdd restriction,
> + "cx_vdd_limit" -> for vdd limit,
> + "modem" -> for processor passive cooling device,
> + "modem_current" -> for current limiting device,
> + "modem_bw" -> for bus bandwidth limiting device,
> + "cpr_cold" -> for cpr restriction.
> +
> + "#cooling-cells":
> + const: 2
> +
> + required:
> + - label
> + - "#cooling-cells"
> +
> + additionalProperties: false
> +
> +required:
> + - qcom,instance-id
> +
> +additionalProperties: false
> +
> +examples:
> + - |
> + #include <dt-bindings/thermal/qcom,tmd.h>
> + modem0 {
> + qcom,instance-id = <MODEM0_INSTANCE_ID>;
> +
> + modem0_pa: tmd-device0 {
> + label = "pa";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_proc: tmd-device1 {
> + label = "modem";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_current: tmd-device2 {
> + label = "modem_current";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_skin: tmd-device3 {
> + label = "modem_skin";
> + #cooling-cells = <2>;
> + };
> +
> + modem0_vdd: tmd-device4 {
> + label = "cpuv_restriction_cold";
> + #cooling-cells = <2>;
> + };
> + };
> +
> + - |
> + #include <dt-bindings/thermal/qcom,tmd.h>
> + adsp {
> + qcom,instance-id = <ADSP_INSTANCE_ID>;
> +
> + adsp_vdd: tmd-device1 {
> + label = "cpuv_restriction_cold";
> + #cooling-cells = <2>;
> + };
> + };
> +
> + - |
> + #include <dt-bindings/thermal/qcom,tmd.h>
> + cdsp {
> + qcom,instance-id = <CDSP_INSTANCE_ID>;
> +
> + cdsp_vdd: tmd-device1 {
> + label = "cpuv_restriction_cold";
> + #cooling-cells = <2>;
> + };
> + };
> +
> + - |
> + #include <dt-bindings/thermal/qcom,tmd.h>
> + slpi {
> + qcom,instance-id = <SLPI_INSTANCE_ID>;
> +
> + slpi_vdd: tmd-device1 {
> + label = "cpuv_restriction_cold";
> + #cooling-cells = <2>;
> + };
> + };
> diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h
> new file mode 100644
> index 000000000000..5ede4422e04e
> --- /dev/null
> +++ b/include/dt-bindings/thermal/qcom,tmd.h
> @@ -0,0 +1,14 @@
> +/* SPDX-License-Identifier: GPL-2.0 */
Dual license.
> +/*
> + * This header provides constants for the Qualcomm TMD instances.
> + */
> +
> +#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_
> +#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_
> +
> +#define MODEM0_INSTANCE_ID 0x0
> +#define ADSP_INSTANCE_ID 0x1
> +#define CDSP_INSTANCE_ID 0x43
> +#define SLPI_INSTANCE_ID 0x53
> +
> +#endif
> --
> 2.37.1
>
>
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