linux-kernel - Re: [PATCH 05/11] dt-bindings: thermal: k3-j72xx: elaborate on binding descriptions

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Date:   Thu, 13 Oct 2022 19:30:36 -0400
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Bryan Brattlof <bb@...com>
Cc:     Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Amit Kucheria <amitk@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>, Nishanth Menon <nm@...com>,
        Vignesh Raghavendra <vigneshr@...com>,
        Tero Kristo <kristo@...nel.org>, Keerthy <j-keerthy@...com>,
        Linux Thermal <linux-pm@...r.kernel.org>,
        Linux Device Tree <devicetree@...r.kernel.org>,
        LKML <linux-kernel@...r.kernel.org>,
        Linux ARM <linux-arm-kernel@...ts.infradead.org>
Subject: Re: [PATCH 05/11] dt-bindings: thermal: k3-j72xx: elaborate on
 binding descriptions

On 12/10/2022 14:19, Bryan Brattlof wrote:
>>> +          temperatures accurately.
>>>  
>>>    power-domains:
>>> +    description: |
>>> +      Should contain the phandle to a power management (PM) domain
>>> +      node and the device-id of this device.
>>
>> This is quite generic - why adding it?
> 
> This was really a "while I'm here" addition. But there is no need, I can 
> drop this

Drop it, we do not describe generic properties (already described in
core schema).

Best regards,
Krzysztof