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Message-Id: <166606235843.3553294.15679468325033987716.b4-ty@kernel.org>
Date: Mon, 17 Oct 2022 22:14:55 -0500
From: Bjorn Andersson <andersson@...nel.org>
To: amitk@...nel.org, Bjorn Andersson <andersson@...nel.org>,
thara.gopinath@...il.com, devicetree@...r.kernel.org,
krzysztof.kozlowski+dt@...aro.org, linux-kernel@...r.kernel.org,
daniel.lezcano@...aro.org, agross@...nel.org,
linux-pm@...r.kernel.org, robh+dt@...nel.org,
konrad.dybcio@...ainline.org, linux-arm-msm@...r.kernel.org,
rui.zhang@...el.com, robimarko@...il.com, rafael@...nel.org
Cc: krzysztof.kozlowski@...aro.org
Subject: Re: (subset) [PATCH v7 1/5] dt-bindings: thermal: tsens: Add ipq8074 compatible
On Fri, 19 Aug 2022 00:02:41 +0200, Robert Marko wrote:
> Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it
> only uses one IRQ, so tsens v2 compatible cannot be used as the fallback.
>
> We also have to make sure that correct interrupts are set according to
> compatibles, so populate interrupt information per compatibles.
>
>
> [...]
Applied, thanks!
[5/5] arm64: dts: ipq8074: add thermal nodes
commit: 887ac08946cc0f2a2b915140fcf8d4365ca9393d
Best regards,
--
Bjorn Andersson <andersson@...nel.org>
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