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Message-ID: <2b0fe8c2-674a-3b44-16aa-d3008b1271c3@linaro.org>
Date: Sat, 22 Oct 2022 13:12:22 +0200
From: Daniel Lezcano <daniel.lezcano@...aro.org>
To: Nicolas Frattaroli <frattaroli.nicolas@...il.com>,
Sebastian Reichel <sebastian.reichel@...labora.com>,
Heiko Stuebner <heiko@...ech.de>,
"Rafael J. Wysocki" <rafael@...nel.org>,
Amit Kucheria <amitk@...nel.org>,
Zhang Rui <rui.zhang@...el.com>,
linux-rockchip@...ts.infradead.org
Cc: Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org,
Finley Xiao <finley.xiao@...k-chips.com>, kernel@...labora.com
Subject: Re: [PATCH 1/2] thermal: rockchip: Support RK3588 SoC in the thermal
driver
On 22/10/2022 10:43, Nicolas Frattaroli wrote:
[ ... ]
>> What is TOP and CENTER ?
>>
>> There are 4 Bigs on this platform but two sensors ?
>
> As far as I know, the four big cores in the SoC are arranged in two
> clusters of two cores each, so one temperature sensor for each
> cluster. As far as I can tell each CPU in a cluster shares its voltage
> with its partner CPU core in its cluster.
Ok, I found some more details on the datasheet, page 7-8.
So it is a big "Cluster" with the 4 Big cores. They share the same cache.
There is one power domain per core (cpuidle)
There are two performance domains (cpufreq x 2)
So it makes sense to have one sensor per performance domain to mitigate
the temperature.
> If you have access to the TRM, it contains the following line in
> part 1 on page 1372:
Unfortunately no, I don't have access to the TRM. But I'll be happy if I
can ;)
> Support to 7 channel TS-ADC (near chip center, A76_0/1, A76_2/3,
> DSU and A55_0/1/2/3, PD_CENTER, NPU, GPU)
>
> I assume one of "TOP" and "CENTER" is "near chip center", the other is
> PD_CENTER, whatever that means (PD = power domain maybe?)
Yes certainly.
I take the opportunity to let you know there is a new tool in the linux
tools directory called 'thermometer'. You can capture the temperature
and use the data to create graphics.
> I agree these could be named more descriptively.
>
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