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Message-ID: <f7eb06a5-9c2d-568a-d363-4f70ffd0c581@linaro.org>
Date:   Wed, 30 Nov 2022 15:33:15 +0100
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Daniel Golle <daniel@...rotopia.org>, linux-pm@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org,
        linux-mediatek@...ts.infradead.org, linux-kernel@...r.kernel.org,
        devicetree@...r.kernel.org,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Amit Kucheria <amitk@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Matthias Brugger <matthias.bgg@...il.com>,
        Rob Herring <robh+dt@...nel.org>
Cc:     Steven Liu <steven.liu@...iatek.com>,
        Henry Yen <Henry.Yen@...iatek.com>
Subject: Re: [PATCH v2 2/2] dt-bindings: thermal: mediatek: add compatible
 string for MT7986 and MT7981 SoC

On 30/11/2022 14:20, Daniel Golle wrote:
> Document compatible string 'mediatek,mt7986-thermal' for V3 thermal
> unit found in MT7986 SoCs.
> 'mediatek,mt7981-thermal' is also added as it is identical with the
> thermal unit of MT7986.
> 
> Signed-off-by: Daniel Golle <daniel@...rotopia.org>
> ---
> Changes since v1: Properly document both supported SoCs


Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof

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