linux-kernel - Re: [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

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Message-ID: <dcd1ae97-e04b-1021-37d5-749d263cdabe@linaro.org>
Date:   Wed, 30 Nov 2022 16:08:37 +0100
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Adam Skladowski <a39.skl@...il.com>
Cc:     phone-devel@...r.kernel.org, ~postmarketos/upstreaming@...ts.sr.ht,
        Rob Clark <robdclark@...il.com>,
        Abhinav Kumar <quic_abhinavk@...cinc.com>,
        Dmitry Baryshkov <dmitry.baryshkov@...aro.org>,
        Sean Paul <sean@...rly.run>, David Airlie <airlied@...il.com>,
        Daniel Vetter <daniel@...ll.ch>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Amit Kucheria <amitk@...nel.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Loic Poulain <loic.poulain@...aro.org>,
        linux-arm-msm@...r.kernel.org, dri-devel@...ts.freedesktop.org,
        freedreno@...ts.freedesktop.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

On 29/11/2022 21:46, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
> 
> Signed-off-by: Adam Skladowski <a39.skl@...il.com>



Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof