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Message-ID: <df1f3014-9432-60b9-a29b-3af77858bcff@linaro.org>
Date: Tue, 6 Dec 2022 18:24:19 +0100
From: Daniel Lezcano <daniel.lezcano@...aro.org>
To: Neil Armstrong <neil.armstrong@...aro.org>,
Bjorn Andersson <andersson@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
Andy Gross <agross@...nel.org>,
Zhang Rui <rui.zhang@...el.com>,
Konrad Dybcio <konrad.dybcio@...ainline.org>,
Thara Gopinath <thara.gopinath@...il.com>,
Rob Herring <robh+dt@...nel.org>,
Amit Kucheria <amitk@...nel.org>,
"Rafael J. Wysocki" <rafael@...nel.org>
Cc: linux-kernel@...r.kernel.org, linux-arm-msm@...r.kernel.org,
devicetree@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH] dt-bindings: thermal: qcom-tsens: Add compatible for
sm8550
On 16/11/2022 11:09, Neil Armstrong wrote:
> The Qualcomm SM8550 platform has three instances of the tsens block,
> add a compatible for these instances.
>
> Signed-off-by: Neil Armstrong <neil.armstrong@...aro.org>
> ---
Applied, thanks
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