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Date:   Tue, 6 Dec 2022 18:24:19 +0100
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     Neil Armstrong <neil.armstrong@...aro.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Andy Gross <agross@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Konrad Dybcio <konrad.dybcio@...ainline.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Rob Herring <robh+dt@...nel.org>,
        Amit Kucheria <amitk@...nel.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>
Cc:     linux-kernel@...r.kernel.org, linux-arm-msm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH] dt-bindings: thermal: qcom-tsens: Add compatible for
 sm8550

On 16/11/2022 11:09, Neil Armstrong wrote:
> The Qualcomm SM8550 platform has three instances of the tsens block,
> add a compatible for these instances.
> 
> Signed-off-by: Neil Armstrong <neil.armstrong@...aro.org>
> ---

Applied, thanks

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