linux-kernel - Re: [PATCH v2 1/2] dt-bindings: arm: rockchip: add Radxa CM3I E25

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Date:   Fri, 9 Dec 2022 15:40:20 -0600
From:   Rob Herring <robh@...nel.org>
To:     Chukun Pan <amadeus@....edu.cn>
Cc:     Peter Geis <pgwipeout@...il.com>, FUKAUMI Naoki <naoki@...xa.com>,
        linux-kernel@...r.kernel.org, Heiko Stuebner <heiko@...ech.de>,
        Rob Herring <robh+dt@...nel.org>,
        linux-arm-kernel@...ts.infradead.org, devicetree@...r.kernel.org,
        linux-rockchip@...ts.infradead.org
Subject: Re: [PATCH v2 1/2] dt-bindings: arm: rockchip: add Radxa CM3I E25


On Fri, 09 Dec 2022 18:25:23 +0800, Chukun Pan wrote:
> Radxa CM3 Industrial (CM3I) is an System on Module made by Radxa
> based on the Rockchip RK3568 SoC. The first carrier board supported
> is the Radxa E25. Add devicetree binding documentation for it.
> 
> Signed-off-by: Chukun Pan <amadeus@....edu.cn>
> ---
>  Documentation/devicetree/bindings/arm/rockchip.yaml | 7 +++++++
>  1 file changed, 7 insertions(+)
> 

Acked-by: Rob Herring <robh@...nel.org>