linux-kernel - Re: [PATCH v3 16/17] dt-bindings: soc: socionext: Add UniPhier DWC3 USB glue layer

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Message-ID: <b0aff55f-978f-48f6-4a86-f6b126ecc649@linaro.org>
Date:   Wed, 14 Dec 2022 14:07:27 +0100
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Kunihiko Hayashi <hayashi.kunihiko@...ionext.com>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>
Cc:     Masami Hiramatsu <mhiramat@...nel.org>, devicetree@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH v3 16/17] dt-bindings: soc: socionext: Add UniPhier DWC3
 USB glue layer

On 13/12/2022 09:24, Kunihiko Hayashi wrote:
> Add DT binding schema for components belonging to the platform-specific
> DWC3 USB glue layer implemented in UniPhier SoCs.
> 
> This USB glue layer works as a sideband logic for the host controller,
> including core reset, vbus control, PHYs, and some signals to the
> controller.
> 
> Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@...ionext.com>
> ---
>  .../socionext,uniphier-dwc3-glue.yaml         | 106 ++++++++++++++++++
>  1 file changed, 106 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml
> 
> diff --git a/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml b/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml
> new file mode 100644
> index 000000000000..bd0def7236b5
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml
> @@ -0,0 +1,106 @@
> +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
> +%YAML 1.2


Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof