linux-kernel - Re: [PATCH v2] arm64: dts: qcom: Re-enable resin on MSM8998 and SDM845 boards

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Message-Id: <167225482209.977158.11261223838020673662.b4-ty@kernel.org>
Date:   Wed, 28 Dec 2022 13:13:42 -0600
From:   Bjorn Andersson <andersson@...nel.org>
To:     dsankouski@...il.com, linux-kernel@...r.kernel.org
Cc:     Rob Herring <robh+dt@...nel.org>,
        "open list:ARM/QUALCOMM SUPPORT" <linux-arm-msm@...r.kernel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" 
        <devicetree@...r.kernel.org>, marijn.suijten@...ainline.org,
        Andy Gross <agross@...nel.org>
Subject: Re: [PATCH v2] arm64: dts: qcom: Re-enable resin on MSM8998 and SDM845 boards

On Wed, 28 Dec 2022 14:52:43 +0300, Dzmitry Sankouski wrote:
> resin node declaration was moved to pm8998.dtsi file (in disabled state).
> MSM8998 and SDM845 boards defining resin node did not previously have
> status="okay" and ended up disabled.
> Re-enable it by using resin node link from pm8998.dtsi with status="okay".
> 
> 

Applied, thanks!

[1/1] arm64: dts: qcom: Re-enable resin on MSM8998 and SDM845 boards
      commit: 4c881ab73a64cdbf8691e258ef17b740d27040a0

Best regards,
-- 
Bjorn Andersson <andersson@...nel.org>