linux-kernel - Re: [PATCH v4 0/3] Add USB/DP combo PHY config for SM6350

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Date:   Thu, 02 Feb 2023 18:40:32 +0000
From:   "Konstantin Ryabitsev" <konstantin.ryabitsev@...ux.dev>
To:     "Luca Weiss" <luca.weiss@...rphone.com>,
        "Vinod Koul" <vkoul@...nel.org>
Cc:     "Andy Gross" <agross@...nel.org>,
        "Bjorn Andersson" <andersson@...nel.org>,
        "Konrad Dybcio" <konrad.dybcio@...aro.org>,
        "Kishon Vijay Abraham I" <kishon@...nel.org>,
        "Rob Herring" <robh+dt@...nel.org>,
        "Krzysztof Kozlowski" <krzysztof.kozlowski+dt@...aro.org>,
        ~postmarketos/upstreaming@...ts.sr.ht, phone-devel@...r.kernel.org,
        linux-arm-msm@...r.kernel.org, linux-phy@...ts.infradead.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        "Johan Hovold" <johan+linaro@...nel.org>,
        "Krzysztof Kozlowski" <krzysztof.kozlowski@...aro.org>
Subject: Re: [PATCH v4 0/3] Add USB/DP combo PHY config for SM6350

February 2, 2023 8:39 AM, "Luca Weiss" <luca.weiss@...rphone.com> wrote:
> On Thu Feb 2, 2023 at 2:19 PM CET, Vinod Koul wrote:
>> Signed-off-by: Luca Weiss <luca.weiss@...rphone.com>
>> 
>> cover doesnt need sob :)
> 
> That comes from b4 ;)
> https://b4.docs.kernel.org

There's a number of subsystems that will use the cover letter as the base message for the merge commit, which is why the signoff is added to the cover.

-K