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Message-ID: <20230211021023.GA13306@ranerica-svr.sc.intel.com>
Date:   Fri, 10 Feb 2023 18:10:23 -0800
From:   Ricardo Neri <ricardo.neri-calderon@...ux.intel.com>
To:     Daniel Lezcano <daniel.lezcano@...aro.org>
Cc:     rafael.j.wysocki@...el.com, linux-pm@...r.kernel.org,
        linux-kernel@...r.kernel.org,
        Guillaume La Roque <glaroque@...libre.com>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Amit Kucheria <amitk@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Miquel Raynal <miquel.raynal@...tlin.com>,
        Florian Fainelli <f.fainelli@...il.com>,
        Ray Jui <rjui@...adcom.com>,
        Scott Branden <sbranden@...adcom.com>,
        Broadcom internal kernel review list 
        <bcm-kernel-feedback-list@...adcom.com>,
        Shawn Guo <shawnguo@...nel.org>,
        Sascha Hauer <s.hauer@...gutronix.de>,
        Pengutronix Kernel Team <kernel@...gutronix.de>,
        Fabio Estevam <festevam@...il.com>,
        NXP Linux Team <linux-imx@....com>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Niklas Söderlund 
        <niklas.soderlund@...natech.se>,
        Bartlomiej Zolnierkiewicz <bzolnier@...il.com>,
        Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>,
        Alim Akhtar <alim.akhtar@...sung.com>,
        Maxime Coquelin <mcoquelin.stm32@...il.com>,
        Alexandre Torgue <alexandre.torgue@...s.st.com>,
        Thierry Reding <thierry.reding@...il.com>,
        Jonathan Hunter <jonathanh@...dia.com>,
        Kunihiko Hayashi <hayashi.kunihiko@...ionext.com>,
        Masami Hiramatsu <mhiramat@...nel.org>,
        ye xingchen <ye.xingchen@....com.cn>,
        Srinivas Pandruvada <srinivas.pandruvada@...ux.intel.com>,
        Haowen Bai <baihaowen@...zu.com>,
        Minghao Chi <chi.minghao@....com.cn>,
        "open list:THERMAL DRIVER FOR AMLOGIC SOCS" 
        <linux-amlogic@...ts.infradead.org>,
        "moderated list:BROADCOM BCM2711/BCM2835 ARM ARCHITECTURE" 
        <linux-rpi-kernel@...ts.infradead.org>,
        "moderated list:BROADCOM BCM2711/BCM2835 ARM ARCHITECTURE" 
        <linux-arm-kernel@...ts.infradead.org>,
        "open list:ARM/QUALCOMM SUPPORT" <linux-arm-msm@...r.kernel.org>,
        "open list:RENESAS R-CAR THERMAL DRIVERS" 
        <linux-renesas-soc@...r.kernel.org>,
        "open list:SAMSUNG THERMAL DRIVER" 
        <linux-samsung-soc@...r.kernel.org>,
        "moderated list:ARM/STM32 ARCHITECTURE" 
        <linux-stm32@...md-mailman.stormreply.com>,
        "open list:TEGRA ARCHITECTURE SUPPORT" <linux-tegra@...r.kernel.org>
Subject: Re: [PATCH] thermal: Remove core header inclusion from drivers

On Mon, Feb 06, 2023 at 04:34:29PM +0100, Daniel Lezcano wrote:
> As the name states "thermal_core.h" is the header file for the core
> components of the thermal framework.
> 
> Too many drivers are including it. Hopefully the recent cleanups
> helped to self encapsulate the code a bit more and prevented the
> drivers to need this header.
> 
> Remove this inclusion in every place where it is possible.
> 
> Some other drivers did a confusion with the core header and the one
> exported in linux/thermal.h. They include the former instead of the
> latter. The changes also fix this.
> 
> The tegra/soctherm driver still remains as it uses an internal
> function which need to be replaced.
> 
> The Intel HFI driver uses the netlink internal framework core and
> should be changed to prevent to deal with the internals.

I don't see any of the thermal netlink functionality exposed. Is
there any work in progress?

FWIW, Acked-by: Ricardo Neri <ricardo.neri-calderon@...ux.intel.com>

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