linux-kernel - Re: [PATCH v1 05/17] thermal/hwmon: Use the right device for devm_thermal_add_hwmon

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Date:   Sun, 19 Feb 2023 18:26:22 +0100
From:   Martin Blumenstingl <martin.blumenstingl@...glemail.com>
To:     Daniel Lezcano <daniel.lezcano@...aro.org>
Cc:     rafael@...nel.org, linux-pm@...r.kernel.org,
        linux-kernel@...r.kernel.org,
        Guillaume La Roque <glaroque@...libre.com>,
        Amit Kucheria <amitk@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Shawn Guo <shawnguo@...nel.org>,
        Sascha Hauer <s.hauer@...gutronix.de>,
        Pengutronix Kernel Team <kernel@...gutronix.de>,
        Fabio Estevam <festevam@...il.com>,
        NXP Linux Team <linux-imx@....com>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Vasily Khoruzhick <anarsoul@...il.com>,
        Yangtao Li <tiny.windzz@...il.com>,
        Chen-Yu Tsai <wens@...e.org>,
        Jernej Skrabec <jernej.skrabec@...il.com>,
        Samuel Holland <samuel@...lland.org>,
        Thierry Reding <thierry.reding@...il.com>,
        Jonathan Hunter <jonathanh@...dia.com>,
        Eduardo Valentin <edubezval@...il.com>,
        Keerthy <j-keerthy@...com>,
        Matthias Brugger <matthias.bgg@...il.com>,
        AngeloGioacchino Del Regno 
        <angelogioacchino.delregno@...labora.com>,
        Daniel Golle <daniel@...rotopia.org>,
        ye xingchen <ye.xingchen@....com.cn>,
        Randy Dunlap <rdunlap@...radead.org>,
        Balsam CHIHI <bchihi@...libre.com>,
        Miquel Raynal <miquel.raynal@...tlin.com>,
        Kunihiko Hayashi <hayashi.kunihiko@...ionext.com>,
        Niklas Söderlund 
        <niklas.soderlund+renesas@...natech.se>,
        "open list:THERMAL DRIVER FOR AMLOGIC SOCS" 
        <linux-amlogic@...ts.infradead.org>,
        "moderated list:ARM/FREESCALE IMX / MXC ARM ARCHITECTURE" 
        <linux-arm-kernel@...ts.infradead.org>,
        "open list:QUALCOMM TSENS THERMAL DRIVER" 
        <linux-arm-msm@...r.kernel.org>,
        "open list:ARM/Allwinner sunXi SoC support" 
        <linux-sunxi@...ts.linux.dev>,
        "open list:TEGRA ARCHITECTURE SUPPORT" <linux-tegra@...r.kernel.org>,
        "open list:TI BANDGAP AND THERMAL DRIVER" 
        <linux-omap@...r.kernel.org>,
        "moderated list:ARM/Mediatek SoC support" 
        <linux-mediatek@...ts.infradead.org>
Subject: Re: [PATCH v1 05/17] thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()

On Sun, Feb 19, 2023 at 3:38 PM Daniel Lezcano
<daniel.lezcano@...aro.org> wrote:
>
> The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
> zone structure pointer as parameter.
>
> Actually, it uses the tz->device to add it in the devres list.
>
> It is preferable to use the device registering the thermal zone
> instead of the thermal zone device itself. That prevents the driver
> accessing the thermal zone structure internals and it is from my POV
> more correct regarding how devm_ is used.
>
> Signed-off-by: Daniel Lezcano <daniel.lezcano@...aro.org>
> ---
>  drivers/thermal/amlogic_thermal.c                  | 2 +-
For amlogic_thermal.c:
Acked-by: Martin Blumenstingl <martin.blumenstingl@...glemail.com>