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Message-ID: <37b3b835-e992-0090-56e5-bd4d58e547a7@linaro.org>
Date:   Thu, 23 Feb 2023 23:56:44 +0100
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     rafael@...nel.org
Cc:     linux-pm@...r.kernel.org, linux-kernel@...r.kernel.org,
        Zhang Rui <rui.zhang@...el.com>, Len Brown <lenb@...nel.org>,
        Damien Le Moal <damien.lemoal@...nsource.wdc.com>,
        Shawn Guo <shawnguo@...nel.org>,
        Sascha Hauer <s.hauer@...gutronix.de>,
        Pengutronix Kernel Team <kernel@...gutronix.de>,
        Fabio Estevam <festevam@...il.com>,
        NXP Linux Team <linux-imx@....com>,
        Jean Delvare <jdelvare@...e.com>,
        Guenter Roeck <linux@...ck-us.net>,
        Jonathan Cameron <jic23@...nel.org>,
        Lars-Peter Clausen <lars@...afoo.de>,
        Chen-Yu Tsai <wens@...e.org>,
        Jernej Skrabec <jernej.skrabec@...il.com>,
        Samuel Holland <samuel@...lland.org>,
        Dmitry Torokhov <dmitry.torokhov@...il.com>,
        "David S. Miller" <davem@...emloft.net>,
        Eric Dumazet <edumazet@...gle.com>,
        Jakub Kicinski <kuba@...nel.org>,
        Paolo Abeni <pabeni@...hat.com>,
        Ido Schimmel <idosch@...dia.com>,
        Petr Machata <petrm@...dia.com>,
        Gregory Greenman <gregory.greenman@...el.com>,
        Kalle Valo <kvalo@...nel.org>,
        Sebastian Reichel <sre@...nel.org>,
        Liam Girdwood <lgirdwood@...il.com>,
        Mark Brown <broonie@...nel.org>,
        Miquel Raynal <miquel.raynal@...tlin.com>,
        Amit Kucheria <amitk@...nel.org>,
        Florian Fainelli <f.fainelli@...il.com>,
        Broadcom internal kernel review list 
        <bcm-kernel-feedback-list@...adcom.com>,
        Ray Jui <rjui@...adcom.com>,
        Scott Branden <sbranden@...adcom.com>,
        Markus Mayer <mmayer@...adcom.com>,
        Support Opensource <support.opensource@...semi.com>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Niklas Söderlund <niklas.soderlund@...natech.se>,
        Heiko Stuebner <heiko@...ech.de>,
        Bartlomiej Zolnierkiewicz <bzolnier@...il.com>,
        Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>,
        Alim Akhtar <alim.akhtar@...sung.com>,
        Orson Zhai <orsonzhai@...il.com>,
        Baolin Wang <baolin.wang@...ux.alibaba.com>,
        Chunyan Zhang <zhang.lyra@...il.com>,
        Vasily Khoruzhick <anarsoul@...il.com>,
        Yangtao Li <tiny.windzz@...il.com>,
        Thierry Reding <thierry.reding@...il.com>,
        Jonathan Hunter <jonathanh@...dia.com>,
        Talel Shenhar <talel@...zon.com>,
        Eduardo Valentin <edubezval@...il.com>,
        Keerthy <j-keerthy@...com>,
        Kunihiko Hayashi <hayashi.kunihiko@...ionext.com>,
        Masami Hiramatsu <mhiramat@...nel.org>,
        Matthias Brugger <matthias.bgg@...il.com>,
        AngeloGioacchino Del Regno 
        <angelogioacchino.delregno@...labora.com>,
        Stefan Wahren <stefan.wahren@...e.com>,
        Zheng Yongjun <zhengyongjun3@...wei.com>,
        Yang Li <yang.lee@...ux.alibaba.com>,
        Srinivas Pandruvada <srinivas.pandruvada@...ux.intel.com>,
        Daniel Golle <daniel@...rotopia.org>,
        Balsam CHIHI <bchihi@...libre.com>,
        Mikko Perttunen <mperttunen@...dia.com>,
        linux-acpi@...r.kernel.org, linux-ide@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org, linux-hwmon@...r.kernel.org,
        linux-iio@...r.kernel.org, linux-sunxi@...ts.linux.dev,
        linux-input@...r.kernel.org, netdev@...r.kernel.org,
        linux-wireless@...r.kernel.org,
        linux-rpi-kernel@...ts.infradead.org,
        linux-arm-msm@...r.kernel.org, linux-renesas-soc@...r.kernel.org,
        linux-rockchip@...ts.infradead.org,
        linux-samsung-soc@...r.kernel.org, linux-tegra@...r.kernel.org,
        linux-omap@...r.kernel.org, linux-mediatek@...ts.infradead.org
Subject: Re: [PATCH v3 00/17] Self-encapsulate the thermal zone device
 structure

On 23/02/2023 23:48, Daniel Lezcano wrote:
> The exported thermal headers expose the thermal core structure while those
> should be private to the framework. The initial idea was the thermal sensor
> drivers use the thermal zone device structure pointer to pass it around from
> the ops to the thermal framework API like a handler.
> 
> Unfortunately, different drivers are using and abusing the internals of this
> structure to hook the associated struct device, read the internals values, take
> the lock, etc ...
> 
> rn order to fix this situation, let's encapsulate the structure leaking the
> more in the different drivers: the thermal_zone_device structure.
> 
> This series revisit the existing drivers using the thermal zone private
> structure internals to change the access to something else. For instance, the
> get_temp() ops is using the tz->dev to write a debug trace. Despite the trace
> is not helpful, we can check the return value for the get_temp() ops in the
> call site and show the message in this place.
> 
> With this set of changes, the thermal_zone_device is almost self-encapsulated.
> As usual, the acpi driver needs a more complex changes, so that will come in a
> separate series along with the structure moved the private core headers.
> 
> Changelog:
> 	- V3:
> 	   - Collected more tags
> 	   - Added missing changes for ->devdata in some drivers
> 	   - Added a 'type' accessor
> 	   - Replaced the 'type' to 'id' changes by the 'type' accessor
> 	   - Used the 'type' accessor in the drivers
> 	- V2:
> 	   - Collected tags
> 	   - Added missing changes for ->devdata for the tsens driver
> 	   - Renamed thermal_zone_device_get_data() to thermal_zone_priv()
> 	   - Added stubs when CONFIG_THERMAL is not set
> 	   - Dropped hwmon change where we remove the tz->lock usage
> 
> Thank you all for your comments

The series has been blocked by gsmtp because the next patch has too many 
Cc. I'll sort out this and resend.


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