linux-kernel - Re: [PATCH 01/15] dt-bindings: thermal: qcom-tsens: Add compatible for SM6375

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Message-ID: <6137e007-a474-0ff6-f3e2-368ede73d879@linaro.org>
Date:   Mon, 6 Mar 2023 09:57:56 +0100
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Konrad Dybcio <konrad.dybcio@...aro.org>,
        Amit Kucheria <amitk@...nel.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Georgi Djakov <djakov@...nel.org>,
        Sibi Sankar <quic_sibis@...cinc.com>
Cc:     linux-arm-msm@...r.kernel.org, linux-pm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH 01/15] dt-bindings: thermal: qcom-tsens: Add compatible
 for SM6375

On 03/03/2023 22:58, Konrad Dybcio wrote:
> The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
> add a compatible for these instances.
> 
> Signed-off-by: Konrad Dybcio <konrad.dybcio@...aro.org>

Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof