linux-kernel - [RESEND] [PATCHv3 7/7] dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible

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Message-Id: <20230308112253.15659-8-sebastian.reichel@collabora.com>
Date:   Wed,  8 Mar 2023 12:22:53 +0100
From:   Sebastian Reichel <sebastian.reichel@...labora.com>
To:     Heiko Stuebner <heiko@...ech.de>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Amit Kucheria <amitk@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>
Cc:     Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        linux-pm@...r.kernel.org, linux-rockchip@...ts.infradead.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        Sebastian Reichel <sebastian.reichel@...labora.com>,
        kernel@...labora.com,
        Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
Subject: [RESEND] [PATCHv3 7/7] dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible

Add a new compatible for the thermal sensor device on RK3588 SoCs.

Reviewed-by: Heiko Stuebner <heiko@...ech.de>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
Signed-off-by: Sebastian Reichel <sebastian.reichel@...labora.com>
---
 Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml | 1 +
 1 file changed, 1 insertion(+)

diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml b/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml
index f6c1be226aaa..55f8ec0bec01 100644
--- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml
+++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.yaml
@@ -19,6 +19,7 @@ properties:
       - rockchip,rk3368-tsadc
       - rockchip,rk3399-tsadc
       - rockchip,rk3568-tsadc
+      - rockchip,rk3588-tsadc
       - rockchip,rv1108-tsadc
 
   reg:
-- 
2.39.2