linux-kernel - [PATCH 0/9] RB1 + QCM2290 support

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Message-Id: <20230403-topic-rb1_qcm-v1-0-ca849b62ba07@linaro.org>
Date:   Mon, 03 Apr 2023 19:35:58 +0200
From:   Konrad Dybcio <konrad.dybcio@...aro.org>
To:     Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Robert Marko <robimarko@...il.com>,
        Das Srinagesh <quic_gurus@...cinc.com>
Cc:     Bhupesh Sharma <bhupesh.sharma@...aro.org>,
        Vladimir Zapolskiy <vladimir.zapolskiy@...aro.org>,
        Marijn Suijten <marijn.suijten@...ainline.org>,
        linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org,
        Konrad Dybcio <konrad.dybcio@...aro.org>
Subject: [PATCH 0/9] RB1 + QCM2290 support

This series brings basic support for the Qualcomm Robotics RB1 board,
including but not limited to:

- TSENS-connected thermal management
- USB2
- eMMC (uSD depends requires regulators to work, will be sent separately)
- the necessary plumbing for *DSP + Wi-Fi (that also needs regulators)
- buttons

A compatible in the SCM C driver is not added on purpose, as:
1. it's not neccessary before we figure out disabling rpmcc, the dt
   part is in regardless (the clock it consumes is always-on today)
2. a point to get rid of SoC-specific compatibles in there was raised

See also:
https://www.thundercomm.com/product/qualcomm-robotics-rb1-platform/
https://www.qualcomm.com/products/internet-of-things/industrial/industrial-automation/qualcomm-robotics-rb1-platform

Dependencies:
- https://lore.kernel.org/linux-arm-msm/20230314-topic-2290_compats-v1-0-47e26c3c0365@linaro.org/
- https://lore.kernel.org/linux-arm-msm/20230315183231.3562580-1-konrad.dybcio@linaro.org/
- https://lore.kernel.org/linux-arm-msm/20230323173019.3706069-1-dianders@chromium.org/

Signed-off-by: Konrad Dybcio <konrad.dybcio@...aro.org>
---
Konrad Dybcio (9):
      dt-bindings: firmware: document Qualcomm QCM2290 SCM
      dt-bindings: arm: qcom: Add QRB2210/QCM2290 and RB1 board
      arm64: dts: qcom: Add initial QCM2290, PM2250 & RB1 device trees
      arm64: dts: qcom: qcm2290: Add most QUPs
      arm64: dts: qcom: qcm2290: Add thermal zones
      arm64: dts: qcom: qcm2290: Add SMP2P
      arm64: dts: qcom: qcm2290: Add ADSP & modem
      arm64: dts: qcom: qcm2290: Add WCN3990 Wi-Fi node
      arm64: dts: qcom: qrb2210-rb1: Enable RESIN Volume Down

 Documentation/devicetree/bindings/arm/qcom.yaml    |    8 +
 .../devicetree/bindings/firmware/qcom,scm.yaml     |    3 +
 arch/arm64/boot/dts/qcom/Makefile                  |    1 +
 arch/arm64/boot/dts/qcom/pm2250.dtsi               |   63 +
 arch/arm64/boot/dts/qcom/qcm2290.dtsi              | 1561 ++++++++++++++++++++
 arch/arm64/boot/dts/qcom/qrb2210-rb1.dts           |  112 ++
 6 files changed, 1748 insertions(+)
---
base-commit: 31bd35b66249699343d2416658f57e97314a433a
change-id: 20230403-topic-rb1_qcm-78a8826b34b6

Best regards,
-- 
Konrad Dybcio <konrad.dybcio@...aro.org>