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Message-ID: <6291728.lOV4Wx5bFT@z3ntu.xyz>
Date:   Sun, 07 May 2023 22:22:39 +0200
From:   Luca Weiss <luca@...tu.xyz>
To:     linux-arm-msm@...r.kernel.org,
        ~postmarketos/upstreaming@...ts.sr.ht
Cc:     ~postmarketos/upstreaming@...ts.sr.ht, phone-devel@...r.kernel.org,
        Matti Lehtimäki <matti.lehtimaki@...il.com>,
        Amit Kucheria <amitk@...nel.org>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org,
        Matti Lehtimäki <matti.lehtimaki@...il.com>
Subject: Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226

On Sonntag, 7. Mai 2023 22:12:20 CEST Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@...il.com>

Reviewed-by: Luca Weiss <luca@...tu.xyz>

> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index
> 926e9c51c93c..d6b2957d5137 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -29,6 +29,7 @@ properties:
>          items:
>            - enum:
>                - qcom,mdm9607-tsens
> +              - qcom,msm8226-tsens
>                - qcom,msm8916-tsens
>                - qcom,msm8939-tsens
>                - qcom,msm8974-tsens




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