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Message-ID: <6291728.lOV4Wx5bFT@z3ntu.xyz>
Date: Sun, 07 May 2023 22:22:39 +0200
From: Luca Weiss <luca@...tu.xyz>
To: linux-arm-msm@...r.kernel.org,
~postmarketos/upstreaming@...ts.sr.ht
Cc: ~postmarketos/upstreaming@...ts.sr.ht, phone-devel@...r.kernel.org,
Matti Lehtimäki <matti.lehtimaki@...il.com>,
Amit Kucheria <amitk@...nel.org>,
Thara Gopinath <thara.gopinath@...il.com>,
Andy Gross <agross@...nel.org>,
Bjorn Andersson <andersson@...nel.org>,
Konrad Dybcio <konrad.dybcio@...aro.org>,
"Rafael J. Wysocki" <rafael@...nel.org>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
Zhang Rui <rui.zhang@...el.com>,
Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org,
Matti Lehtimäki <matti.lehtimaki@...il.com>
Subject: Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226
On Sonntag, 7. Mai 2023 22:12:20 CEST Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
>
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@...il.com>
Reviewed-by: Luca Weiss <luca@...tu.xyz>
> ---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
> 1 file changed, 1 insertion(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index
> 926e9c51c93c..d6b2957d5137 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -29,6 +29,7 @@ properties:
> items:
> - enum:
> - qcom,mdm9607-tsens
> + - qcom,msm8226-tsens
> - qcom,msm8916-tsens
> - qcom,msm8939-tsens
> - qcom,msm8974-tsens
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