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Message-ID: <ZFvo2TIiPiMFlbXC@yoga>
Date: Thu, 11 May 2023 00:26:25 +0530
From: Anup Sharma <anupnewsmail@...il.com>
To: Jonathan Cameron <jic23@...nel.org>,
Lars-Peter Clausen <lars@...afoo.de>,
Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
Conor Dooley <conor+dt@...nel.org>,
Anup Sharma <anupnewsmail@...il.com>,
Peter Meerwald <pmeerw@...erw.net>, broonie@...nel.org
Cc: linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org
Subject: [PATCH] dt-bindings: iio: temperature: Add DT bindings for TMP006
Add devicetree binding document for TMP006, IR thermopile sensor.
Signed-off-by: Anup Sharma <anupnewsmail@...il.com>
---
.../bindings/iio/temperature/ti,tmp006.yaml | 38 +++++++++++++++++++
1 file changed, 38 insertions(+)
create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
new file mode 100644
index 000000000000..c6c5a4d10898
--- /dev/null
+++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
@@ -0,0 +1,38 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: TI TMP006 IR thermopile sensor
+
+maintainers:
+ - Peter Meerwald <pmeerw@...erw.net>
+
+description: |
+ TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
+ https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
+
+properties:
+ compatible:
+ const: ti,tmp006
+
+ reg:
+ maxItems: 1
+
+required:
+ - compatible
+ - reg
+
+additionalProperties: false
+
+examples:
+ - |
+ i2c {
+ #address-cells = <1>;
+ #size-cells = <0>;
+ tmp006@40 {
+ compatible = "ti,tmp006";
+ reg = <0x40>;
+ };
+ };
--
2.34.1
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